发明授权
US07342053B2 Resin composition, adhesive film using the same and multilayer printed circuit board
有权
树脂组合物，使用其的粘合膜和多层印刷电路板
- 专利标题： Resin composition, adhesive film using the same and multilayer printed circuit board
- 专利标题（中）： 树脂组合物，使用其的粘合膜和多层印刷电路板
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申请号： US11044060申请日： 2005-01-28
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公开(公告)号： US07342053B2公开(公告)日： 2008-03-11
- 发明人: Shigeo Nakamura
- 申请人： Shigeo Nakamura
- 申请人地址： JP Tokyo
- 专利权人： Ajinomoto Co., Inc.
- 当前专利权人： Ajinomoto Co., Inc.
- 当前专利权人地址： JP Tokyo
- 代理机构： Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
- 优先权： JP2004-019923 20040128; JP2004-183138 20040621
- 主分类号： C08F2/46
- IPC分类号： C08F2/46 ; C08F12/36 ; C09J4/00 ; H01L21/00 ; H01L21/02
摘要：
Producing a printed circuit board, by coating a resin composition comprising an aromatic cyanate compound having two or more cyanato groups in a molecule and a radical-polymerizable resin on a circuit substrate, photo-curing the resin composition, and thermally curing the photo-cured resin composition to thereby form an insulation layer, affords an insulation layer with improved surface smoothness and excellent dielectric properties.
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