发明授权
- 专利标题: Photonic interconnect system
- 专利标题(中): 光子互连系统
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申请号: US10684278申请日: 2003-10-11
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公开(公告)号: US07343059B2公开(公告)日: 2008-03-11
- 发明人: Raymond G. Beausoleil , Philip J. Kuekes , William J. Munro , Timothy P. Spiller , Richard S. Williams , Sean D. Barrett
- 申请人: Raymond G. Beausoleil , Philip J. Kuekes , William J. Munro , Timothy P. Spiller , Richard S. Williams , Sean D. Barrett
- 申请人地址: US TX Houston
- 专利权人: Hewlett-Packard Development Company, L.P.
- 当前专利权人: Hewlett-Packard Development Company, L.P.
- 当前专利权人地址: US TX Houston
- 主分类号: G02B6/12
- IPC分类号: G02B6/12 ; G02B6/122 ; G02B6/13
摘要:
A photonic interconnect system avoids high capacitance electric interconnects by using optical signals to communicate data between devices. The system can provide massively parallel information output by mapping logical addresses to frequency bands, so that modulation of a selected frequency band can encode information for a specific location corresponding to the logical address. Wavelength-specific directional couplers, modulators, and detectors for the photonic interconnect system can be efficiently fabricated at defects in a photonic bandgap crystal.
公开/授权文献
- US20050078902A1 Photonic interconnect system 公开/授权日:2005-04-14
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