发明授权
- 专利标题： Structure and method for releasing stressy metal films
- 专利标题（中）： 用于释放应力金属膜的结构和方法
-
申请号： US11300872申请日： 2005-12-15
-
公开(公告)号： US07344906B2公开(公告)日： 2008-03-18
- 发明人: Christopher L. Chua , David K. Fork , Koenraed F. Van Schuylenbergh
- 申请人： Christopher L. Chua , David K. Fork , Koenraed F. Van Schuylenbergh
- 申请人地址： US CA Palo Alto
- 专利权人： Palo Alto Research Center Incorporated
- 当前专利权人： Palo Alto Research Center Incorporated
- 当前专利权人地址： US CA Palo Alto
- 代理商 Kent Chen
- 主分类号： H01L21/00
- IPC分类号： H01L21/00
摘要：
A method and structure for forming a spring structure that avoids undesirable kinks in the spring is described. The method converts a portion of a release layer such that the converted portion resists etching. The converted portion then serves as an anchor region for a spring structure deposited over the release layer. When the non-converted portions of the release layer are etched, the spring curls out of the plane of a plane.
公开/授权文献
- US20070141742A1 Structure and method for releasing stressy metal films 公开/授权日：2007-06-21
信息查询
IPC分类:
