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    Structure and method for releasing stressy metal films
    1.
    发明授权
    Structure and method for releasing stressy metal films 有权
    用于释放应力金属膜的结构和方法

    公开(公告)号：US07344906B2

    公开(公告)日：2008-03-18

    申请号：US11300872

    申请日：2005-12-15

    申请人： Christopher L. Chua ,  David K. Fork ,  Koenraed F. Van Schuylenbergh

    发明人： Christopher L. Chua ,  David K. Fork ,  Koenraed F. Van Schuylenbergh

    IPC分类号： H01L21/00

    CPC分类号： B81C1/0015 ,  Y10T428/24942

    摘要： A method and structure for forming a spring structure that avoids undesirable kinks in the spring is described. The method converts a portion of a release layer such that the converted portion resists etching. The converted portion then serves as an anchor region for a spring structure deposited over the release layer. When the non-converted portions of the release layer are etched, the spring curls out of the plane of a plane.

    摘要翻译： 描述了形成弹簧结构的方法和结构，其避免了弹簧中不希望的扭结。 该方法将释放层的一部分转换成转换部分抵抗蚀刻。 转换的部分然后用作沉积在释放层上的弹簧结构的锚定区域。 当剥离层的未转化部分被蚀刻时，弹簧卷曲在平面的平面之外。

    PRINTING SYSTEM EMPLOYING DEFORMABLE POLYMER PRINTING PLATES
    2.
    发明申请
    PRINTING SYSTEM EMPLOYING DEFORMABLE POLYMER PRINTING PLATES 有权
    打印系统采用可变聚合物印刷板

    公开(公告)号：US20110271857A1

    公开(公告)日：2011-11-10

    申请号：US13185188

    申请日：2011-07-18

    申请人： Jürgen H. Daniel ,  Dirk De Bruyker ,  David K. Fork ,  Christopher L. Chua

    发明人： Jürgen H. Daniel ,  Dirk De Bruyker ,  David K. Fork ,  Christopher L. Chua

    IPC分类号： B41C3/00

    CPC分类号： B41C1/00 ,  B41C1/1041 ,  B41C1/186 ,  B41N1/12 ,  B41N1/22 ,  B41N3/00 ,  B41N3/003 ,  B41N3/006

    摘要： A printing plate has a substrate, an array of cells on the substrate, wherein each cell corresponds to an element of a print image, a deformable polymer material localized into the cells such that each cell is at least partially formed from the deformable polymer material, a reservoir corresponding to each cell to collect the deformable polymer material as needed when the deformable polymer material is one of either melted or softened, and a heater to cause the deformable polymer material to either melt or soften. A method of forming a printing plate provides an array of cells, first heats the array of cells such that the deformable polymer material does one of either melts or softens, actuates the cells in the array to assume a deformed state, cools the array of cells to solidify the cells in the deformed state, second heats the cells such that the deformable polymer material in selected ones of the cells does one of either soften or melt and return to a less deformed state to form a printing pattern, and cools the surface to solidify the deformable polymer material in the printing pattern. A method of forming a printing plate provides an array of cells, heats the array of cells such that the deformable polymer material softens, actuates selected ones of the cells to deform surfaces of the selected ones to form a printing pattern, and cools the array of cells to solidify the printing pattern into a printing plate.

    摘要翻译： 印版具有衬底，衬底上的单元阵列，其中每个单元对应于印刷图像的元素，位于单元中的可变形聚合物材料，使得每个单元至少部分地由可变形聚合物材料形成， 当可变形聚合物材料是熔化或软化之一时，根据需要收集可变形聚合物材料的储存器，以及使可变形聚合物材料熔融或软化的加热器。 形成印版的方法提供了一个单元阵列，首先加热单元阵列，使得可变形的聚合物材料进行融化或软化之一，致动阵列中的单元以呈现变形状态，冷却单元阵列 使细胞在变形状态下固化，第二加热细胞，使得选定细胞中的可变形聚合物材料进行软化或熔化，并恢复到较小的变形状态以形成印刷图案，并将表面冷却至 使印刷图案中的可变形聚合物材料固化。 形成印版的方法提供了一个单元阵列，加热单元阵列使得可变形的聚合物材料软化，致动所选择的单元格以使选定的单元的表面变形以形成印刷图案，并且冷却 细胞将印刷图案固化成印版。

    PRINTING SYSTEM EMPLOYING DEFORMABLE POLYMER PRINTING PLATES
    5.
    发明申请
    PRINTING SYSTEM EMPLOYING DEFORMABLE POLYMER PRINTING PLATES 有权
    打印系统采用可变聚合物印刷板

    公开(公告)号：US20080141884A1

    公开(公告)日：2008-06-19

    申请号：US11613141

    申请日：2006-12-19

    申请人： Jurgen H. Daniel ,  Dirk De Bruyker ,  David K. Fork ,  Christopher L. Chua

    发明人： Jurgen H. Daniel ,  Dirk De Bruyker ,  David K. Fork ,  Christopher L. Chua

    IPC分类号： B41N1/12

    CPC分类号： B41C1/00 ,  B41C1/1041 ,  B41C1/186 ,  B41N1/12 ,  B41N1/22 ,  B41N3/00 ,  B41N3/003 ,  B41N3/006

    摘要： A printing plate has a substrate, an array of cells on the substrate, wherein each cell corresponds to an element of a print image, a deformable polymer material localized into the cells such that each cell is at least partially formed from the deformable polymer material, a reservoir corresponding to each cell to collect the deformable polymer material as needed when the deformable polymer material is one of either melted or softened, and a heater to cause the deformable polymer material to either melt or soften. A method of forming a printing plate provides an array of cells, first heats the array of cells such that the deformable polymer material does one of either melts or softens, actuates the cells in the array to assume a deformed state, cools the array of cells to solidify the cells in the deformed state, second heats the cells such that the deformable polymer material in selected ones of the cells does one of either soften or melt and return to a less deformed state to form a printing pattern, and cools the surface to solidify the deformable polymer material in the printing pattern. A method of forming a printing plate provides an array of cells, heats the array of cells such that the deformable polymer material softens, actuates selected ones of the cells to deform surfaces of the selected ones to form a printing pattern, and cools the array of cells to solidify the printing pattern into a printing plate.

    摘要翻译： 印版具有衬底，衬底上的单元阵列，其中每个单元对应于印刷图像的元素，位于单元中的可变形聚合物材料，使得每个单元至少部分地由可变形聚合物材料形成， 当可变形聚合物材料是熔化或软化之一时，根据需要收集可变形聚合物材料的储存器，以及使可变形聚合物材料熔融或软化的加热器。 形成印版的方法提供了一个单元阵列，首先加热单元阵列，使得可变形的聚合物材料进行融化或软化之一，致动阵列中的单元以呈现变形状态，冷却单元阵列 使细胞在变形状态下固化，第二加热细胞，使得选定细胞中的可变形聚合物材料进行软化或熔化，并恢复到较小的变形状态以形成印刷图案，并将表面冷却至 使印刷图案中的可变形聚合物材料固化。 形成印版的方法提供了一个单元阵列，加热单元阵列使得可变形的聚合物材料软化，致动所选择的单元格以使选定的单元的表面变形以形成印刷图案，并且冷却 细胞将印刷图案固化成印版。

    High force metal plated spring structure
    7.
    发明授权
    High force metal plated spring structure 有权
    高强度金属电镀弹簧结构

    公开(公告)号：US07015584B2

    公开(公告)日：2006-03-21

    申请号：US10615653

    申请日：2003-07-08

    申请人： Eugene M. Chow ,  David K. Fork ,  Thomas Hantschel ,  Koenraad F. Van Schuylenbergh ,  Christopher L. Chua

    发明人： Eugene M. Chow ,  David K. Fork ,  Thomas Hantschel ,  Koenraad F. Van Schuylenbergh ,  Christopher L. Chua

    IPC分类号： H01L23/48

    CPC分类号： F16F1/027

    摘要： Lithographically defined and etched spring structures are produced by various methods such that they avoid the formation of a plated metal wedge on an underside of the spring structure after release. A post is utilized to offset the spring from an underlying substrate by a distance greater than the thickness of the plated metal. A trench is etched into the substrate below the spring to provide clearance during deflection of the spring. Another spring includes a knee (bend) that provides the necessary clearance during deflection. A plating process is limited to the upper side of another spring. A released spring is used as a shadow mask for patterning resist that prevents wedge formation during plating. Various tip arrangements are disclosed that can be utilized with each spring structure

    摘要翻译： 通过各种方法制造光刻定义和蚀刻的弹簧结构，使得它们在释放之后避免在弹簧结构的下侧上形成电镀金属楔。 使用柱子将弹簧从下面的衬底偏移大于电镀金属的厚度的距离。 在弹簧下方的衬底中蚀刻沟槽，以在弹簧偏转期间提供间隙。 另一个弹簧包括在偏转期间提供必要的间隙的膝盖（弯头）。 电镀工艺限于另一弹簧的上侧。 释放的弹簧用作用于图案化抗蚀剂的荫罩，其防止电镀期间的楔形成。 公开了可以与每个弹簧结构一起使用的各种尖端装置

    Amorphous silicon sensor with micro-spring interconnects for achieving high uniformity in integrated light-emitting sources
    9.
    发明授权
    Amorphous silicon sensor with micro-spring interconnects for achieving high uniformity in integrated light-emitting sources 有权
    具有微弹簧互连的非晶硅传感器，用于实现集成发光源的高均匀性

    公开(公告)号：US06794725B2

    公开(公告)日：2004-09-21

    申请号：US09469122

    申请日：1999-12-21

    申请人： Francesco Lemmi ,  Christopher L. Chua ,  Ping Mei ,  JengPing Lu ,  David K. Fork ,  Harry J. McIntyre

    发明人： Francesco Lemmi ,  Christopher L. Chua ,  Ping Mei ,  JengPing Lu ,  David K. Fork ,  Harry J. McIntyre

    IPC分类号： H01L3100

    CPC分类号： H01L31/1055 ,  B41J2/45 ,  H01L25/0753 ,  H01L31/1016 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01S5/02 ,  H01S5/0262 ,  H01S5/4025 ,  H01L2924/00

    摘要： A hybrid structure or device is provided wherein carried on a single substrate is at least one micro-spring interconnect having an elastic material that is initially fixed to a surface of the substrate, an anchor portion which is fixed to the substrate surface and a free portion. The spring contact is self-assembling in that as the free portion is released it moves out of the plane of the substrate. Also integrated on the substrate is a sensor having an active layer and contacts. The substrate and sensor may be formed of materials which are somewhat partially transparent to light at certain infrared wavelengths. The integrated sensor/spring contact configuration may be used in an imaging system to sense output from a light source which is used for image formation. The light source may be a laser array, LED array or other appropriate light source. The sensor is appropriately sized to sense all or some part of light from the light source. The sensor may also be sufficiently transparent so that light is not blocked from its emission path, with a contrast ratio such that it only absorbs a small fraction of light passing therethrough. An additional characteristic is that the manufacturing process is compatible with the manufacturing process for the micro-spring interconnects. Data from the sensor is used as light source correction information. This information is provided to a calibration configuration which allows for calibration of high-speed systems.

    摘要翻译： 提供了一种混合结构或装置，其中承载在单个基板上的是具有弹性材料的至少一个微弹簧互连，弹性材料最初固定到基板的表面，固定到基板表面的锚定部分和自由部分 。 弹簧接触件是自组装的，因为随着自由部分的释放，它移出基板的平面。 还集成在基板上的是具有有源层和触点的传感器。 衬底和传感器可以由对某些红外波长的光稍微部分透明的材料形成。 集成的传感器/弹簧接触配置可用于成像系统中以感测用于图像形成的光源的输出。 光源可以是激光阵列，LED阵列或其他合适的光源。 传感器的尺寸适当，可以感测来自光源的全部或部分光线。 传感器也可以是足够透明的，使得光不被其发射路径阻挡，对比度使得其仅吸收通过其中的一小部分光。 另外的特征是制造工艺与微弹簧互连的制造工艺兼容。 来自传感器的数据用作光源校正信息。 该信息被提供给允许校准高速系统的校准配置。