发明授权
US07344945B1 Method of manufacturing a drain side gate trench metal-oxide-semiconductor field effect transistor
失效
制造漏极侧栅极沟槽金属氧化物半导体场效应晶体管的方法
- 专利标题: Method of manufacturing a drain side gate trench metal-oxide-semiconductor field effect transistor
- 专利标题(中): 制造漏极侧栅极沟槽金属氧化物半导体场效应晶体管的方法
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申请号: US11023327申请日: 2004-12-22
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公开(公告)号: US07344945B1公开(公告)日: 2008-03-18
- 发明人: Deva Pattanayak , Jason (Jianhai) Qi , Yuming Bai , Kam-Hong Lui , Ronald Wong
- 申请人: Deva Pattanayak , Jason (Jianhai) Qi , Yuming Bai , Kam-Hong Lui , Ronald Wong
- 申请人地址: US CA Santa Clara
- 专利权人: Vishay-Siliconix
- 当前专利权人: Vishay-Siliconix
- 当前专利权人地址: US CA Santa Clara
- 主分类号: H01L21/336
- IPC分类号: H01L21/336
摘要:
Embodiments of the present invention provide a striped or closed cell trench metal-oxide-semiconductor field effect transistor (TMOSFET). The striped or closed cell TMOSFET comprises a source region, a body region disposed above the source region, a drift region disposed above the body region, a drain region disposed above the drift region. A gate region is disposed above the source region and adjacent the body region. A gate insulator region electrically isolates the gate region from the source region, body region, drift region and drain region. The body region is electrically coupled to the source region.
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