Invention Grant
- Patent Title: Silicon carrier having increased flexibility
- Patent Title (中): 硅载体具有增加的灵活性
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Application No.: US11323568Application Date: 2005-12-30
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Publication No.: US07345353B2Publication Date: 2008-03-18
- Inventor: Bucknell C. Webb
- Applicant: Bucknell C. Webb
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Ference & Associates LLC
- Main IPC: H01L23/58
- IPC: H01L23/58
Abstract:
An apparatus and method providing flexibility to a silicon chip carrier which, in at least one embodiment, comprises multiple chips and a silicon chip carrier having thinned regions between some adjacent chips, thus, allowing for increased flexibility and reduced package warpage.
Public/Granted literature
- US20070152346A1 Silicon carrier having increased flexibility Public/Granted day:2007-07-05
Information query
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