发明授权
- 专利标题： Wiring patterns formed by selective metal plating
- 专利标题（中）： 通过选择性金属电镀形成的布线图案
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申请号： US10905590申请日： 2005-01-12
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公开(公告)号： US07345370B2公开(公告)日： 2008-03-18
- 发明人: Toshiharu Furukawa , Mark C. Hakey , Steven J. Holmes , David V. Horak , Charles W. Koburger, III
- 申请人： Toshiharu Furukawa , Mark C. Hakey , Steven J. Holmes , David V. Horak , Charles W. Koburger, III
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理机构： Gibb & Rahman, LLC
- 代理商 Ira D. Blecker, Esq.
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
Conductive sidewall spacer structures are formed using a method that patterns structures (mandrels) and activates the sidewalls of the structures. Metal ions are attached to the sidewalls of the structures and these metal ions are reduced to form seed material. The structures are then trimmed and the seed material is plated to form wiring on the sidewalls of the structures.
公开/授权文献
- US20060154463A1 WIRING PATTERNS FORMED BY SELECTIVE METAL PLATING 公开/授权日：2006-07-13
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