Invention Grant
- Patent Title: Method and apparatus for characterizing microelectromechanical devices on wafers
- Patent Title (中): 用于表征晶片上的微机电装置的方法和装置
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Application No.: US10875555Application Date: 2004-06-23
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Publication No.: US07345806B2Publication Date: 2008-03-18
- Inventor: Dmitri Simonian , Casey Feinstein
- Applicant: Dmitri Simonian , Casey Feinstein
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Wade James Brady, III; Frederick J. Telecky, Jr.
- Main IPC: G02B26/00
- IPC: G02B26/00 ; H01J5/16
Abstract:
The invention provides a method and apparatus for evaluating the quality of microelectromechanical devices having deformable and deflectable members using resonation techniques. Specifically, product quality characterized in terms of uniformity of the deformable and deflectable elements is inspected with an optical resonance mapping mechanism on a wafer-level.
Public/Granted literature
- US20050286105A1 Method and apparatus for characterizing microelectromechanical devices on wafers Public/Granted day:2005-12-29
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