Method and apparatus for characterizing microelectromechanical devices on wafers
    3.
    发明授权
    Method and apparatus for characterizing microelectromechanical devices on wafers 有权
    用于表征晶片上的微机电装置的方法和装置

    公开(公告)号:US07345806B2

    公开(公告)日:2008-03-18

    申请号:US10875555

    申请日:2004-06-23

    IPC分类号: G02B26/00 H01J5/16

    CPC分类号: G01N21/956 G01N21/9501

    摘要: The invention provides a method and apparatus for evaluating the quality of microelectromechanical devices having deformable and deflectable members using resonation techniques. Specifically, product quality characterized in terms of uniformity of the deformable and deflectable elements is inspected with an optical resonance mapping mechanism on a wafer-level.

    摘要翻译: 本发明提供一种用于使用谐振技术来评估具有可变形和可偏转构件的微机电装置的质量的方法和装置。 具体地说,利用晶片级上的光学共振映射机构来检查以可变形和可偏转元件的均匀性为特征的产品质量。

    Method and apparatus for characterizing microelectromechanical devices on wafers
    4.
    发明申请
    Method and apparatus for characterizing microelectromechanical devices on wafers 有权
    用于表征晶片上的微机电装置的方法和装置

    公开(公告)号:US20050286105A1

    公开(公告)日:2005-12-29

    申请号:US10875555

    申请日:2004-06-23

    IPC分类号: G01N21/95 G02B26/08

    CPC分类号: G01N21/956 G01N21/9501

    摘要: The invention provides a method and apparatus for evaluating the quality of microelectromechanical devices having deformable and deflectable members using resonation techniques. Specifically, product quality characterized in terms of uniformity of the deformable and deflectable elements is inspected with an optical resonance mapping mechanism on a wafer-level.

    摘要翻译: 本发明提供一种用于使用谐振技术来评估具有可变形和可偏转构件的微机电装置的质量的方法和装置。 具体地说,利用晶片级上的光学共振映射机构来检查以可变形和可偏转元件的均匀性为特征的产品质量。

    Method for selectively treating surfaces
    5.
    发明授权
    Method for selectively treating surfaces 有权
    选择性处理表面的方法

    公开(公告)号:US09046684B1

    公开(公告)日:2015-06-02

    申请号:US13548061

    申请日:2012-07-12

    摘要: A method of treating a surface includes providing an object and applying a masking layer to a target surface area of the object. A sacrificial material is applied to a non-target surface area of the object. The method also includes removing the masking layer from the target surface area. The target surface area is exposed to a substance that etches or coats the target surface area. The sacrificial material from the non-target surface area of the object is removed, leaving the target surface area of the object etched or coated by the substance while the non-target surface area is not etched or coated by the substance.

    摘要翻译: 处理表面的方法包括提供物体并将掩模层施加到物体的目标表面区域。 将牺牲材料施加到物体的非目标表面区域。 该方法还包括从目标表面区域去除掩模层。 目标表面积暴露于蚀刻或涂覆目标表面积的物质。 除去物体的非目标表面区域的牺牲材料,留下被物体蚀刻或涂覆的物体的目标表面积,同时非目标表面积未被物质蚀刻或涂覆。