Invention Grant
US07348216B2 Rework process for removing residual UV adhesive from C4 wafer surfaces
有权
从C4晶圆表面去除残余UV粘合剂的返工工艺
- Patent Title: Rework process for removing residual UV adhesive from C4 wafer surfaces
- Patent Title (中): 从C4晶圆表面去除残余UV粘合剂的返工工艺
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Application No.: US11243882Application Date: 2005-10-04
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Publication No.: US07348216B2Publication Date: 2008-03-25
- Inventor: Steven R. Codding , Timothy C. Krywanczyk , Edmund J. Sprogis , Jocelyn Sylvestre , Matthew R. Whalen
- Applicant: Steven R. Codding , Timothy C. Krywanczyk , Edmund J. Sprogis , Jocelyn Sylvestre , Matthew R. Whalen
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent William H. Steinberg
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A method for the removal of residual UV radiation-sensitive adhesive from the surfaces of semiconductor wafers, remaining thereon from protective UV radiation-sensitive tapes which were stripped from the semiconductor wafers. Moreover, provided is an arrangement for implementing the removal of residual sensitive adhesive, which remain from tapes employed as protective layers on semiconductor wafers, particularly wafers having surfaces including C4 connections.
Public/Granted literature
- US20070077752A1 Rework process for removing residual UV adhesive from C4 wafer surfaces Public/Granted day:2007-04-05
Information query
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