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1.发明授权Ultraviolet energy curable tape and method of making a semiconductor chip using the tape 有权紫外线固化胶带和使用胶带制造半导体芯片的方法公开(公告)号：US08163602B2
公开(公告)日：2012-04-24
申请号：US13011509
申请日：2011-01-21
IPC分类号： H01L21/44
CPC分类号： H01L21/67132
摘要： There is provided a UV energy curable tape comprising an adhesive material including a UV energy curable oligomer, a UV energy initiator, and a material which emits optical light when the tape composition is substantially fully cured. A semiconductor chip made using the tape is also provided.
摘要翻译： 提供了一种UV能量可固化带，其包括粘合剂材料，其包括UV能量可固化低聚物，UV能量引发剂和当带组合物基本上完全固化时发射光的材料。 还提供了使用带制成的半导体芯片。
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2.发明申请ULTRAVIOLET ENERGY CURABLE TAPE AND METHOD OF MAKING A SEMICONDUCTOR CHIP USING THE TAPE 有权超紫外线能量可变带和使用带制造半导体芯片的方法公开(公告)号：US20110115072A1
公开(公告)日：2011-05-19
申请号：US13011509
申请日：2011-01-21
CPC分类号： H01L21/67132
摘要： There is provided a UV energy curable tape comprising an adhesive material including a UV energy curable oligomer, a UV energy initiator, and a material which emits optical light when the tape composition is substantially fully cured. A semiconductor chip made using the tape is also provided.
摘要翻译： 提供了一种UV能量可固化带，其包括粘合剂材料，其包括UV能量可固化低聚物，UV能量引发剂和当带组合物基本上完全固化时发射光的材料。 还提供了使用带制成的半导体芯片。
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3.发明授权公开(公告)号：US07348216B2
公开(公告)日：2008-03-25
申请号：US11243882
申请日：2005-10-04
申请人： Steven R. Codding , Timothy C. Krywanczyk , Edmund J. Sprogis , Jocelyn Sylvestre , Matthew R. Whalen
发明人： Steven R. Codding , Timothy C. Krywanczyk , Edmund J. Sprogis , Jocelyn Sylvestre , Matthew R. Whalen
IPC分类号： H01L21/00
CPC分类号： H01L21/67132 , H01L21/02057 , H01L21/67028
摘要： A method for the removal of residual UV radiation-sensitive adhesive from the surfaces of semiconductor wafers, remaining thereon from protective UV radiation-sensitive tapes which were stripped from the semiconductor wafers. Moreover, provided is an arrangement for implementing the removal of residual sensitive adhesive, which remain from tapes employed as protective layers on semiconductor wafers, particularly wafers having surfaces including C4 connections.
摘要翻译： 从半导体晶片剥离的保护性紫外线辐射敏感带保留在其上的半导体晶片的表面上去除残留的UV辐射敏感性粘合剂的方法。 此外，提供了一种用于实现从半导体晶片上用作保护层的带留下的残留敏感性粘合剂的去除，特别是具有包括C4连接的表面的晶片的布置。
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4.发明授权Ultraviolet energy curable tape and method of making a semiconductor chip using the tape 有权紫外线固化胶带和使用胶带制造半导体芯片的方法公开(公告)号：US07902682B2
公开(公告)日：2011-03-08
申请号：US10715689
申请日：2003-11-18
IPC分类号： H01L23/48
CPC分类号： H01L21/67132
摘要： There is provided a UV energy curable tape comprising an adhesive material including a UV energy curable oligomer, a UV energy initiator, and a material which emits optical light when the tape composition is substantially fully cured. A semiconductor chip made using the tape is also provided.
摘要翻译： 提供了一种UV能量可固化带，其包括粘合剂材料，其包括UV能量可固化低聚物，UV能量引发剂和当带组合物基本上完全固化时发射光的材料。 还提供了使用带制成的半导体芯片。
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5.发明授权Methods to prevent ECC (edge chipping and cracking) damage during die picking process 失效在拣货过程中防止ECC（边缘切屑和开裂）损坏的方法公开(公告)号：US07771560B2
公开(公告)日：2010-08-10
申请号：US11863356
申请日：2007-09-28
IPC分类号： B32B38/10
CPC分类号： H01L21/67092 , H01L21/67132 , Y10S438/976 , Y10T156/1132 , Y10T156/1179 , Y10T156/1944 , Y10T156/1983
摘要： A method for preventing edge chipping and cracking damage encountered by semiconductor chips in a die picking operation during separation from an adhesive sheet. Also provided is a device for preventing potential edge chipping and cracking damage encountered by a semiconductor chip during die picking processes.
摘要翻译： 一种用于防止在从粘合片分离过程中的模具拾取操作中半导体芯片遇到边缘碎裂和破裂损伤的方法。 还提供了一种用于在拣选过程中防止半导体芯片遇到的潜在边缘碎裂和破裂损坏的装置。
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6.发明申请METHODS TO PREVENT ECC (EDGE CHIPPING AND CRACKING) DAMAGE DURING DIE PICKING PROCESS 失效防止DIE抓取过程中ECC（边缘剥离和破裂）损害的方法公开(公告)号：US20090084499A1
公开(公告)日：2009-04-02
申请号：US11863356
申请日：2007-09-28
IPC分类号： B32B38/10
CPC分类号： H01L21/67092 , H01L21/67132 , Y10S438/976 , Y10T156/1132 , Y10T156/1179 , Y10T156/1944 , Y10T156/1983
摘要： A method for preventing edge chipping and cracking damage encountered by semiconductor chips in a die picking operation during separation from an adhesive sheet. Also provided is a device for preventing potential edge chipping and cracking damage encountered by a semiconductor chip during die picking processes.
摘要翻译： 一种用于防止在从粘合片分离期间的模具拾取操作中半导体芯片遇到的边缘碎裂和破裂损伤的方法。 还提供了一种用于在拣选过程中防止半导体芯片遇到的潜在边缘碎裂和破裂损坏的装置。
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公开(公告)号：US07288465B2
公开(公告)日：2007-10-30
申请号：US11117122
申请日：2005-04-28
申请人： Allan D. Abrams , Donald W. Brouillette , Joseph D. Danaher , Timothy C. Krywanczyk , Rene A. Lamothe , Ivan J. Stone , Matthew R. Whalen
发明人： Allan D. Abrams , Donald W. Brouillette , Joseph D. Danaher , Timothy C. Krywanczyk , Rene A. Lamothe , Ivan J. Stone , Matthew R. Whalen
CPC分类号： H01L21/3081 , H01L21/304 , H01L2221/6834
摘要： There is provided a method for making a wafer comprising the steps of providing a substrate having a first surface, an opposite second surface, and at least one side edge defining a thickness of the substrate, the at least one side edge having a first peripheral region and a second peripheral region adjacent to the first peripheral region. The method includes applying a fluid to the first surface and the first peripheral region of the at least one side edge and removing the opposite second surface and the second peripheral region of the at least one side edge to form a third surface. A semiconductor chip made from the method for making the wafer is also provided.
摘要翻译： 提供了一种用于制造晶片的方法，包括以下步骤：提供具有第一表面，相对的第二表面和限定衬底的厚度的至少一个侧边缘的衬底，所述至少一个侧边缘具有第一周边区域 以及与第一周边区域相邻的第二周边区域。 该方法包括将流体施加到至少一个侧边缘的第一表面和第一周边区域，并且移除至少一个侧边缘的相对的第二表面和第二周边区域以形成第三表面。 还提供了由制造晶片的方法制成的半导体芯片。
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公开(公告)号：US07001827B2
公开(公告)日：2006-02-21
申请号：US10413698
申请日：2003-04-15
申请人： Allan D. Abrams , Donald W. Brouillette , Joseph D. Danaher , Timothy C. Krywanczyk , Rene A. Lamothe , Ivan J. Stone , Matthew R. Whalen
发明人： Allan D. Abrams , Donald W. Brouillette , Joseph D. Danaher , Timothy C. Krywanczyk , Rene A. Lamothe , Ivan J. Stone , Matthew R. Whalen
CPC分类号： H01L21/304 , H01L2221/6834
摘要： There is provided a method for making a wafer including the steps of providing a substrate having a first surface, an opposite second surface, and at least one side edge defining a thickness of the substrate, the at least one side edge having a first peripheral region and a second peripheral region adjacent to the first peripheral region. The method includes applying a fluid to the first surface and the first peripheral region of the at least one side edge and removing the opposite second surface and the second peripheral region of the at least one side edge to form a third surface. A semiconductor chip made from the method for making the wafer is also provided.
摘要翻译： 提供了一种用于制造晶片的方法，包括以下步骤：提供具有第一表面，相对的第二表面的基底和限定基底的厚度的至少一个侧边缘，所述至少一个侧边缘具有第一周边区域 以及与第一周边区域相邻的第二周边区域。 该方法包括将流体施加到至少一个侧边缘的第一表面和第一周边区域，并且移除至少一个侧边缘的相对的第二表面和第二周边区域以形成第三表面。 还提供了由制造晶片的方法制成的半导体芯片。
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9.发明授权Application of a thermally conductive thin film to a wafer backside prior to dicing to prevent chipping and cracking 有权在切割之前将导热薄膜应用于晶片背面以防止碎裂和开裂公开(公告)号：US07387911B2
公开(公告)日：2008-06-17
申请号：US10990778
申请日：2004-11-16
申请人： David M Audette , Steven R. Codding , Timothy C. Krywanczyk , Brian J. Thibault , Matthew R. Whalen
发明人： David M Audette , Steven R. Codding , Timothy C. Krywanczyk , Brian J. Thibault , Matthew R. Whalen
IPC分类号： H01L21/50 , H01L21/48 , H01L21/44 , H01L21/46 , H01L23/544 , H01L21/768 , H01L21/78
CPC分类号： H01L23/562 , H01L21/78 , H01L23/36 , H01L23/3737 , H01L2924/0002 , H01L2924/00
摘要： A thermally conductive protective film or layer is applied to the backside surface of a semiconductor wafer prior to a subsequent dicing operation performed on the wafer to singulate the wafer into diced semiconductor chips, during which the thin thermally conductive film minimizes and prevents chipping and cracking damage to the wafer and diced chips. During subsequent electrical operation of a diced chip, the thin thermally conductive film functions as a thermal conductor to dissipate and conduct away to a heat sink any heat generated during operation of the chip.
摘要翻译： 在对晶片进行随后的切割操作之前，将导热保护膜或层施加到半导体晶片的背面，以便将晶片分成切割的半导体芯片，在此期间，薄导热膜最小化并防止切屑和破裂损伤 到晶圆和切片芯片。 在切割芯片的随后的电操作期间，薄的导热膜用作热导体，以在芯片的操作期间产生的热量消散并导向散热器。
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