发明授权
- 专利标题： System and method for noise reduction in multi-layer ceramic packages
- 专利标题（中）： 多层陶瓷封装中降噪的系统和方法
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申请号： US11086719申请日： 2005-03-22
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公开(公告)号： US07348667B2公开(公告)日： 2008-03-25
- 发明人: Sungjun Chun , Jason Lee Frankel , Anand Haridass , Erich Klink , Brian Leslie Singletary
- 申请人： Sungjun Chun , Jason Lee Frankel , Anand Haridass , Erich Klink , Brian Leslie Singletary
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理商 Stephen J. Walder, Jr.; Casimer K. Salys
- 主分类号： H01L23/34
- IPC分类号： H01L23/34
摘要：
A system and method for reducing noise in a multi-layer ceramic package are provided. With the system and method, additional shielding wires are inserted into the reference planes wherever there are no signal vias present. These additional lines in the reference planes force stronger signal interaction with the reference (vdd/gnd) thereby reducing the interaction between the signals in the signal layers. As a result, the noise present in the signals of the signal layers is reduced.
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