发明授权
- 专利标题： Method of providing printed circuit board with conductive holes and board resulting therefrom
- 专利标题（中）： 为印刷电路板提供导电孔和由此产生的板的方法
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申请号： US11397713申请日： 2006-04-05
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公开(公告)号： US07348677B2公开(公告)日： 2008-03-25
- 发明人: James M. Larnerd , John M. Lauffer , Voya R. Markovich , Kostas I. Papathomas
- 申请人： James M. Larnerd , John M. Lauffer , Voya R. Markovich , Kostas I. Papathomas
- 申请人地址： US NY Endicott
- 专利权人： Endicott Interconnect Technologies, Inc.
- 当前专利权人： Endicott Interconnect Technologies, Inc.
- 当前专利权人地址： US NY Endicott
- 代理机构： Hinman, Howard & Kattell, LLP
- 代理商 Lawrence R. Fraley
- 主分类号： H01L29/40
- IPC分类号： H01L29/40
摘要：
A method of making a printed circuit board in which conductive thru-holes are formed within two dielectric layers of the board's structure so as to connect designated conductive layers. One hole connects two adjacent layers and the other connects two adjacent layers, including one of the conductive layers connected by the other hole. It is also possible to connect all three conductive layers using one or more holes. The resulting holes may be filled, e.g., with metal plating, or conductive or non-conductive paste. In the case of the latter, it is also possible to provide a top covering conductive layer over the paste, e.g., to serve as a pad or the like on the board's external surface.
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