Invention Grant
- Patent Title: Printed circuit board including embedded capacitor having high dielectric constant and method of fabricating same
- Patent Title (中): 印刷电路板包括具有高介电常数的嵌入式电容器及其制造方法
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Application No.: US10999442Application Date: 2004-11-29
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Publication No.: US07351915B2Publication Date: 2008-04-01
- Inventor: Jin-Yong Ahn , Chang-Sup Ryu , Suk-Hyeon Cho , Seok-Kyu Lee , Jong-Kuk Hong , Ho-Sik Jun
- Applicant: Jin-Yong Ahn , Chang-Sup Ryu , Suk-Hyeon Cho , Seok-Kyu Lee , Jong-Kuk Hong , Ho-Sik Jun
- Applicant Address: KR Kyunggi-do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Kyunggi-do
- Agency: Darby & Darby, P.C.
- Priority: KR10-2004-0067487 20040826
- Main IPC: H05K1/16
- IPC: H05K1/16
Abstract:
A printed circuit board (PCB) having at least one embedded capacitor and a method of fabricating the same is provided. A dielectric layer is formed using a ceramic material having a high capacitance, thereby assuring that the capacitors each have a high dielectric constant corresponding to the capacitance of a decoupling chip capacitor.
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