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    Method of manufacturing printed circuit board
    7.
    发明授权
    Method of manufacturing printed circuit board 有权
    制造印刷电路板的方法

    公开(公告)号：US07971352B2

    公开(公告)日：2011-07-05

    申请号：US12213465

    申请日：2008-06-19

    申请人： Shuhichi Okabe ,  Jin-Yong An ,  Seok-Kyu Lee ,  Soon-Oh Jung ,  Jong-Kuk Hong ,  Hae-Nam Seo

    发明人： Shuhichi Okabe ,  Jin-Yong An ,  Seok-Kyu Lee ,  Soon-Oh Jung ,  Jong-Kuk Hong ,  Hae-Nam Seo

    IPC分类号： H01R9/00 ,  H05K3/00

    CPC分类号： H05K3/4682 ,  H05K3/108 ,  H05K3/205 ,  H05K3/3473 ,  H05K2201/0367 ,  H05K2203/0376 ,  H05K2203/043 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49149

    摘要： A method of manufacturing a printed circuit board having solder balls. The method may include: stacking a second carrier, in which at least one hole is formed, over one side of a first carrier; forming at least one solder bump by filling the hole with a conductive material; forming a circuit pattern layer, which is electrically connected with the solder bump, on the second carrier; and exposing the solder bump by removing the first carrier and the second carrier. Using this method, uniform hemispherical solder balls with fine pitch can be formed as a part of the manufacturing process, without having to attach the solder balls separately. Carriers may be used to serve as supports during the manufacturing process, whereby deformations can be prevented in the board.

    摘要翻译： 一种制造具有焊球的印刷电路板的方法。 该方法可以包括：在第一载体的一侧堆叠形成有至少一个孔的第二载体; 通过用导电材料填充孔而形成至少一个焊料凸块; 在所述第二载体上形成与所述焊料凸块电连接的电路图案层; 以及通过去除所述第一载体和所述第二载体来暴露所述焊料凸块。 使用这种方法，可以形成具有细间距的均匀的半球形焊球作为制造过程的一部分，而不必分别附接焊球。 可以在制造过程中使用载体作为支撑体，从而可以防止板的变形。

    Method of manufacturing printed circuit board
    8.
    发明申请
    Method of manufacturing printed circuit board 有权
    制造印刷电路板的方法

    公开(公告)号：US20090151160A1

    公开(公告)日：2009-06-18

    申请号：US12213465

    申请日：2008-06-19

    申请人： Shuhichi Okabe ,  Jin-Yong An ,  Seok-Kyu Lee ,  Soon-Oh Jung ,  Jong-Kuk Hong ,  Hae-Nam Seo

    发明人： Shuhichi Okabe ,  Jin-Yong An ,  Seok-Kyu Lee ,  Soon-Oh Jung ,  Jong-Kuk Hong ,  Hae-Nam Seo

    IPC分类号： H05K3/10 ,  H05K3/36

    CPC分类号： H05K3/4682 ,  H05K3/108 ,  H05K3/205 ,  H05K3/3473 ,  H05K2201/0367 ,  H05K2203/0376 ,  H05K2203/043 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49149

    摘要： A method of manufacturing a printed circuit board having solder balls. The method may include: stacking a second carrier, in which at least one hole is formed, over one side of a first carrier; forming at least one solder bump by filling the hole with a conductive material; forming a circuit pattern layer, which is electrically connected with the solder bump, on the second carrier; and exposing the solder bump by removing the first carrier and the second carrier. Using this method, uniform hemispherical solder balls with fine pitch can be formed as a part of the manufacturing process, without having to attach the solder balls separately. Carriers may be used to serve as supports during the manufacturing process, whereby deformations can be prevented in the board.

    摘要翻译： 一种制造具有焊球的印刷电路板的方法。 该方法可以包括：在第一载体的一侧堆叠形成有至少一个孔的第二载体; 通过用导电材料填充孔而形成至少一个焊料凸块; 在所述第二载体上形成与所述焊料凸块电连接的电路图案层; 以及通过去除所述第一载体和所述第二载体来暴露所述焊料凸块。 使用这种方法，可以形成具有细间距的均匀的半球形焊球作为制造过程的一部分，而不必分别附接焊球。 可以在制造过程中使用载体作为支撑体，从而可以防止板的变形。

    Multilayered printed circuit board and manufacturing method thereof
    9.
    发明申请
    Multilayered printed circuit board and manufacturing method thereof 审中-公开
    多层印刷电路板及其制造方法

    公开(公告)号：US20090038837A1

    公开(公告)日：2009-02-12

    申请号：US12078176

    申请日：2008-03-27

    申请人： Shuhichi Okabe ,  Jin-Yong An ,  Seok-Kyu Lee ,  Soon-Oh Jung ,  Jong-Kuk Hong ,  Hae-Nam Seo

    发明人： Shuhichi Okabe ,  Jin-Yong An ,  Seok-Kyu Lee ,  Soon-Oh Jung ,  Jong-Kuk Hong ,  Hae-Nam Seo

    IPC分类号： H05K1/11 ,  B32B38/10

    CPC分类号： H05K3/462 ,  H05K3/205 ,  H05K3/243 ,  H05K3/421 ,  H05K3/4623 ,  H05K3/4644 ,  H05K2201/09527 ,  H05K2201/09563 ,  H05K2201/096

    摘要： A multilayered printed circuit board is disclosed. A method of manufacturing the multilayered printed circuit board, which includes: forming a metal layer and a lower-circuit-forming pattern in order on a carrier, and forming a lower circuit by filling a conductive material in the lower-circuit-forming pattern; removing the lower-circuit-forming pattern, stacking an insulation resin, and forming at least one via hole connecting with the lower circuit; forming at least one inner circuit and at least one interlayer connector connecting the inner circuit with the lower circuit on the insulation resin, to form a pair of circuit parts; and aligning the pair of circuit parts, attaching the pair of circuit parts to each other, and removing the carrier and the metal layer, allows the forming of fine-lined circuits and provides a thin board, while preventing bending and warpage in the board.

    摘要翻译： 公开了一种多层印刷电路板。 一种制造多层印刷电路板的方法，包括：在载体上依次形成金属层和下电路形成图案，并通过在下电路形成图案中填充导电材料形成下层电路; 去除下部电路形成图案，堆叠绝缘树脂，并形成与下部电路连接的至少一个通孔; 在所述绝缘树脂上形成至少一个内部电路和连接所述内部电路与所述下部电路的至少一个层间连接器，以形成一对电路部件; 并且将一对电路部件对准，将一对电路部件彼此连接，并且移除载体和金属层，允许形成精细的电路并提供薄板，同时防止板的弯曲和翘曲。