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US07354623B2 Surface modification of a porous organic material through the use of a supercritical fluid 有权
通过使用超临界流体对多孔有机材料进行表面改性

Surface modification of a porous organic material through the use of a supercritical fluid
Abstract:
An organic layer, such as a porous low-K dielectric in an IC, contains pores open at its surface. To close the pores, the organic layer is contacted by a supercritical fluid that is a solvent for the layer. After a small amount of the surface and the wall of the open pores is solvated, a phase transition of the solvated organic material is effected at the surface to cover it with a dense, smooth, non-porous film that seals the open pores.
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