发明授权
- 专利标题： Submount substrate for mounting light emitting device and method of fabricating the same
- 专利标题（中）： 用于安装发光器件的底座基板及其制造方法
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申请号： US11633613申请日： 2006-12-05
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公开(公告)号： US07354846B2公开(公告)日： 2008-04-08
- 发明人: Geun Ho Kim , Chil Keun Park
- 申请人： Geun Ho Kim , Chil Keun Park
- 申请人地址： KR Seoul
- 专利权人： LG Electronics Inc.
- 当前专利权人： LG Electronics Inc.
- 当前专利权人地址： KR Seoul
- 代理机构： Ked & Associates, LLP
- 优先权： KR10-2004-053640 20040706
- 主分类号： H01L21/22
- IPC分类号： H01L21/22 ; H01L21/38
摘要：
A submount substrate for mounting a light emitting device and a method of fabricating the same, wherein since a submount substrate for mouthing a light emitting device in which a Zener diode device is integrated can be fabricated by means of a silicon bulk micromachining process without using a diffusion mask, some steps of processes related to the diffusion mask can be eliminated to reduce the manufacturing costs, and wherein since a light emitting device can be flip-chip bonded directly to a submount substrate for a light emitting device in which a Zener diode device is integrated, a process of packaging the light emitting device and the voltage regulator device can be simplified.
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