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发明授权
US07355862B2 Printed wiring board, method of manufacturing the printed wiring board, lead frame package, and optical module 有权
印刷电路板，制造印刷电路板的方法，引线框架封装和光学模块

Printed wiring board, method of manufacturing the printed wiring board, lead frame package, and optical module
摘要：
A printed wiring board includes a plurality of conductor plates that includes at least one conductor plate that is used as a lead for electrical connection with an external circuit, the conductor plates being separated spatially from one another; an insulating layer formed on or across the conductor plates or both on and across the conductor plates; and a plurality of wiring patterns formed on the insulating layer. At least one of the conductor plates is electrically connected with at least one of the wiring patterns through a via-hole.
摘要（中）：

印刷布线板包括多个导体板，其包括至少一个导体板，该导体板用作与外部电路电连接的引线，导体板彼此空间分离; 在导体板上或横跨导体板上形成绝缘层，或者两者在导体板上并跨过导体板; 以及形成在所述绝缘层上的多个布线图案。 至少一个导体板通过通孔与至少一个布线图形电连接。

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