Invention Grant
- Patent Title: Process control method
- Patent Title (中): 过程控制方法
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Application No.: US11027412Application Date: 2004-12-30
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Publication No.: US07356380B2Publication Date: 2008-04-08
- Inventor: Shing-Sheng Yu , Chih-Ming Ke , Burn Jeng Lin
- Applicant: Shing-Sheng Yu , Chih-Ming Ke , Burn Jeng Lin
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Thomas, Kayden, Horstemeyer & Risley
- Main IPC: G06F19/00
- IPC: G06F19/00

Abstract:
A methodology for doing process control by using a heating apparatus comprising heating zones is revealed. First, a target CD (critical dimension) map is assigned. A baseline CD map corresponding to a substrate processed with the heating apparatus at a baseline setting is also obtained. An original CD map corresponding to a substrate processed at an original setting is obtained. For each heating zone, a perturbed CD map corresponding to a substrate processed at a perturbed setting is also obtained. The temperature distribution of the heating apparatus is adjusted according to the error CD map defined by the baseline CD map and the target CD map, basis functions defined by the original CD map and perturbed CD maps, and expansion coefficients expanding the error CD map with basis functions.
Public/Granted literature
- US20060196960A1 Process control method Public/Granted day:2006-09-07
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