Invention Grant
- Patent Title: Component mounting method
- Patent Title (中): 组件安装方法
-
Application No.: US10537304Application Date: 2003-12-02
-
Publication No.: US07356918B2Publication Date: 2008-04-15
- Inventor: Osamu Okuda , Kazuo Kido , Hideki Uchida , Haneo Iwamoto , Takashi Yazawa , Kazuyuki Yoshidomi
- Applicant: Osamu Okuda , Kazuo Kido , Hideki Uchida , Haneo Iwamoto , Takashi Yazawa , Kazuyuki Yoshidomi
- Applicant Address: JP Osaka
- Assignee: Matsushita Electric Industrial Co., Ltd.
- Current Assignee: Matsushita Electric Industrial Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2002-349852 20021202; JP2003-397077 20031127
- International Application: PCT/JP03/15376 WO 20031202
- International Announcement: WO2004/052072 WO 20040617
- Main IPC: H05K3/30
- IPC: H05K3/30

Abstract:
An X-Y robot having a structure that linearly deforms along an X-axis direction and a Y-axis direction, a camera reference mark, and a control unit are provided. The X-Y robot causes no displacement of warp or the like and linearly deforms along only the X-axis direction and the Y-axis direction even if heat takes effect due to continuous operation. Therefore, if the amount of expansion and contraction of the X-Y robot due to heat is obtained by picking-up an image of the camera reference mark by a board recognition camera and the component placing position is corrected on the basis of the amount of expansion and contraction, then an electronic component can be mounted in a prescribed position or almost in the prescribed position.
Public/Granted literature
- US20060048380A1 Parts mounting device and method Public/Granted day:2006-03-09
Information query