Invention Grant
- Patent Title: Wafer pod with working sheet holder
- Patent Title (中): 具有工作板支架的晶片盒
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Application No.: US11242701Application Date: 2005-10-04
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Publication No.: US07357256B2Publication Date: 2008-04-15
- Inventor: Chia-Cheng Lin
- Applicant: Chia-Cheng Lin
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Thomas, Kayden, Horstemeyer & Risley
- Main IPC: B65D85/48
- IPC: B65D85/48
Abstract:
A wafer pod. The wafer pod comprises a main body, a working sheet holder disposed on the main body, and a lock disposed between the working sheet holder and the main body. The working sheet holder is fixed to the main body by the lock to form an accommodating space.
Public/Granted literature
- US20060219591A1 Wafer pod with working sheet holder Public/Granted day:2006-10-05
Information query
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