Invention Grant
- Patent Title: Power distribution system
- Patent Title (中): 配电系统
-
Application No.: US10685175Application Date: 2003-10-14
-
Publication No.: US07358446B2Publication Date: 2008-04-15
- Inventor: Sachin Navin Chheda , Ricardo E. Espinoza-Ibarra , Kirk Yates
- Applicant: Sachin Navin Chheda , Ricardo E. Espinoza-Ibarra , Kirk Yates
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: H05K1/16
- IPC: H05K1/16

Abstract:
A power distribution system comprises a flexible power connector, a printed circuit board, a power supply, and a processor mounted on the printed circuit board. The flexible power connector comprises a first end electrically connected to the processor and a second end electrically connected to the power supply. The flexible power connector is configured with a length so that the power supply is in a spaced relationship relative to the processor and the flexible power connector includes a plurality of stacked layers arranged generally parallel to each other for distributed power transmission. These layers include at least two ground layers and at least one power layer. The power layer is sandwiched between two of the at least two ground layers.
Public/Granted literature
- US20050078463A1 Power distribution system Public/Granted day:2005-04-14
Information query