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US07358580B2 Sacrificial layer technique to make gaps in MEMS applications 有权
牺牲层技术在MEMS应用中产生空白

Sacrificial layer technique to make gaps in MEMS applications
Abstract:
A method comprising over an area of a substrate, forming a plurality of three dimensional first structures; following forming the first structures, conformally introducing a sacrificial material over the area of the substrate; introducing a second structural material over the sacrificial material; and removing the sacrificial material. An apparatus comprising a first structure on a substrate; and a second structure on the substrate and separated from the first structure by an unfilled gap defined by the thickness of a removed film.
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