发明授权
- 专利标题： Embedded capacitors and methods for their fabrication and connection
- 专利标题（中）： 嵌入式电容器及其制造和连接方法
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申请号： US11316087申请日： 2005-12-21
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公开(公告)号： US07361568B2公开(公告)日： 2008-04-22
- 发明人: Gregory J. Dunn , Remy J. Chelini , Robert T. Croswell , Philip M. Lessner , Michael D. Prevallet , John D. Prymak
- 申请人： Gregory J. Dunn , Remy J. Chelini , Robert T. Croswell , Philip M. Lessner , Michael D. Prevallet , John D. Prymak
- 申请人地址： US IL Schaumburg
- 专利权人： Motorola, Inc.
- 当前专利权人： Motorola, Inc.
- 当前专利权人地址： US IL Schaumburg
- 主分类号： H01L21/20
- IPC分类号： H01L21/20 ; H01L29/00 ; H01L23/48 ; H01G4/005
摘要：
Embedded capacitors comprise a bimetal foil (500) that includes a first copper layer (205) and an aluminum layer (210) on the first copper layer. The aluminum layer has a smooth side adjacent the first copper layer and a high surface area textured side (215) opposite the first copper layer. The bimetal foil further includes an aluminum oxide layer (305) on the high surface area textured side of the aluminum layer, a conductive polymerlayer (420) on the aluminum oxide layer, and a second copper layer (535) overlying the aluminum oxide layer. The bimetal foil may be embedded in a circuit board (700) to form high value embedded capacitors.
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