Invention Grant
- Patent Title: Molded high density electronic packaging structure for high performance applications
- Patent Title (中): 成型高密度电子封装结构，适用于高性能应用
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Application No.: US10543301Application Date: 2004-02-03
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Publication No.: US07361995B2Publication Date: 2008-04-22
- Inventor: Kim Yong Goh , Rahul Kapoor , Anthony Yi-Sheng Sun , Desmond Yok Rue Chong , Lan H. Hoang
- Applicant: Kim Yong Goh , Rahul Kapoor , Anthony Yi-Sheng Sun , Desmond Yok Rue Chong , Lan H. Hoang
- Applicant Address: US CA San Jose SG Singapore
- Assignee: Xilinx, Inc.,UTAC - United Test and Assembly Test Center Ltd.
- Current Assignee: Xilinx, Inc.,UTAC - United Test and Assembly Test Center Ltd.
- Current Assignee Address: US CA San Jose SG Singapore
- Agency: Sughrue Mion, PLLC
- International Application: PCT/US2004/002985 WO 20040203
- International Announcement: WO2004/070790 WO 20040819
- Main IPC: H01L29/40
- IPC: H01L29/40
Abstract:
A thermally enhanced ball grid array package is disclosed. The package includes a base layer element and a flip chip die mounted on the base layer element. The die has a first surface electrically coupled to the base layer element, a second surface opposite to the first surface, and lateral sides. A molding compound encapsulates the base layer element and the lateral sides of the die. A surface is formed of the second surface of the die and an upper surface of the molding compound. A material is disposed on the surface, and a heat spreader is mounted on the material.
Public/Granted literature
- US20060087033A1 Molded high density electronic packaging structure for high performance applications Public/Granted day:2006-04-27
Information query
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