发明授权
- 专利标题： Pillar grid array package
- 专利标题（中）： 支柱网格阵列包
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申请号： US11228234申请日： 2005-09-19
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公开(公告)号： US07368809B2公开(公告)日： 2008-05-06
- 发明人: Hsiang-Ming Huang , Yeong-Ching Chao , Yi-Chang Lee , An-Hong Liu
- 申请人： Hsiang-Ming Huang , Yeong-Ching Chao , Yi-Chang Lee , An-Hong Liu
- 申请人地址： BM Hamilton HM 12 TW Hsinchu
- 专利权人： ChipMOS Technologies (Bermuda) Ltd.,ChipMOS Technologies Inc.
- 当前专利权人： ChipMOS Technologies (Bermuda) Ltd.,ChipMOS Technologies Inc.
- 当前专利权人地址： BM Hamilton HM 12 TW Hsinchu
- 代理机构： Troxell Law Office, PLLC
- 优先权： TW94111881A 20050414
- 主分类号： H01L23/02
- IPC分类号： H01L23/02 ; H01L21/44
摘要：
A pillar grid array package (PGA) includes a substrate, a chip disposed on top of the substrate, and a plurality of stud bumps disposed on bottom of the substrate. The stud bumps are formed in an array and each has a flattened top to electrically connect to a printed circuit board, PCB, by an anisotropic conductive paste to achieve a thin package and to avoid substrate warpage problems of a ball grid array (BGA) during high-temperature reflow processes.
公开/授权文献
- US20060231941A1 Pillar grid array package 公开/授权日：2006-10-19
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