发明授权
US07371622B2 Etchant for signal wire and method of manufacturing thin film transistor array panel using etchant
有权
信号线蚀刻剂和使用蚀刻剂制造薄膜晶体管阵列面板的方法
- 专利标题: Etchant for signal wire and method of manufacturing thin film transistor array panel using etchant
- 专利标题(中): 信号线蚀刻剂和使用蚀刻剂制造薄膜晶体管阵列面板的方法
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申请号: US10772293申请日: 2004-02-06
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公开(公告)号: US07371622B2公开(公告)日: 2008-05-13
- 发明人: Hong-Sick Park , Hong-Je Cho , Sung-Chul Kang , Pong-Ok Park , An-Na Park
- 申请人: Hong-Sick Park , Hong-Je Cho , Sung-Chul Kang , Pong-Ok Park , An-Na Park
- 申请人地址: KR Suwon-Si
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR Suwon-Si
- 代理机构: F. Chau & Associates, LLC.
- 优先权: KR10-2003-0034007 20030528
- 主分类号: H01L21/00
- IPC分类号: H01L21/00
摘要:
Gate lines including a lower Al—Nd layer and an upper MoW layer, data lines including a MoW layer, and pixel electrodes including an IZO layer are patterned using a single etchant. The etchant contains a phosphoric acid of about 50-60%, a nitric acid of about 6-10%, an acetic acid of about 15-25%, a stabilizer of about 2-5% stabilizer, and deionized water. The stabilizer includes oxy-hydride inorganic acid represented by M(OH)XLY, where M includes at least one of Zn, Sn, Cr, Al, Ba, Fe, Ti, Si and B, L includes at least one of H2O, NH3, CN and NH2R (where R is alkyl group), X is 2 or 3, and Y is 0, 1, 2 or 3.
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