发明授权
- 专利标题: Apparatus and methods for the inspection of microvias in printed circuit boards
- 专利标题(中): 用于检查印刷电路板中微孔的装置和方法
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申请号: US11517924申请日: 2006-09-07
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公开(公告)号: US07372632B2公开(公告)日: 2008-05-13
- 发明人: Todd E. Lizotte
- 申请人: Todd E. Lizotte
- 申请人地址: JP Ebina-shi, Kanagawa
- 专利权人: Hitachi Via Mechanics, Ltd.
- 当前专利权人: Hitachi Via Mechanics, Ltd.
- 当前专利权人地址: JP Ebina-shi, Kanagawa
- 代理机构: Davis Bujold & Daniels, P.L.L.C.
- 主分类号: G02B27/10
- IPC分类号: G02B27/10 ; G06K9/00 ; H04N9/47 ; G01N21/00
摘要:
An imaging method and imaging system for inspecting features located at a known inter-feature pitch on portions of a target surface. The system includes a lens array having a plurality of lenses wherein the lenses of the lens array have an inter-lens pitch and an inter-field of view pitch corresponding to the inter-feature pitch, and an array of imaging elements having an inter-element pitch corresponding to the inter-feature pitch, whereby the imaging system images only field of view areas of the target surface containing features.
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