A printed circuit board with vias that reduce or eliminate radio frequency interference and method of forming the same. The printed circuit board includes non-conductive layers, conductive-layers interspersed between the non-conductive layers, vias extending through the non-conductive layers and the conductive layers, radio frequency absorbing material within each of the vias, where the radio frequency absorbing material is at a conductive layer within the printed circuit board at which a conductive trace is not connected to a via, an insulating layer over each radio frequency absorbing material, and a cylindrical conductive material within via and over each insulating layer.