Invention Grant
US07377306B2 Radiation fin, cooling device, electronic equipment, and manufacturing method of cooling device
有权
散热片，冷却装置，电子设备及冷却装置的制造方法
- Patent Title: Radiation fin, cooling device, electronic equipment, and manufacturing method of cooling device
- Patent Title (中): 散热片，冷却装置，电子设备及冷却装置的制造方法
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Application No.: US11637090Application Date: 2006-12-12
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Publication No.: US07377306B2Publication Date: 2008-05-27
- Inventor: Toshio Hashimoto
- Applicant: Toshio Hashimoto
- Applicant Address: JP
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP
- Agency: Rader Fishman & Grauer PLLC
- Agent Ronald P. Kananen
- Priority: JP2003-414322 20031212
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
Each of fins is provided with an engage projection having a first width and a engage hole portion having a second width wider than the first width, and the fins are able to be slid while engaging with each other. Accordingly, in case of installing a heat sink to a case of a fan, it is possible to install the fins to the case so that the fins are arranged in a flowing direction of a refrigerant by the fan while engaging with each other. As the result, the refrigerant is able to flow smoothly when passing through the fins by arranging the fins at desired angle. Accordingly, it becomes possible to present a radiation fin, a cooling device and an electronic equipment having such cooling device.
Public/Granted literature
- US20070084584A1 Radiation fin, cooling device, electronic equipment, and manufacturing method of cooling device Public/Granted day:2007-04-19
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