Invention Grant
- Patent Title: Method of manufacturing nitride semiconductor device
- Patent Title (中): 氮化物半导体器件的制造方法
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Application No.: US11143685Application Date: 2005-06-03
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Publication No.: US07378351B2Publication Date: 2008-05-27
- Inventor: Katsuomi Shiozawa , Toshiyuki Oishi , Kazushige Kawasaki , Zempei Kawazu , Yuji Abe
- Applicant: Katsuomi Shiozawa , Toshiyuki Oishi , Kazushige Kawasaki , Zempei Kawazu , Yuji Abe
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Denki Kabushiki Kaisha
- Current Assignee: Mitsubishi Denki Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
- Priority: JP2004-165718 20040603
- Main IPC: H01L21/302
- IPC: H01L21/302 ; H01L21/461

Abstract:
A nitride semiconductor device is manufactured by the step of forming a nitride semiconductor layer form on a GaN substrate main surface, the step of polishing a back surface of the GaN substrate formed with the above-mentioned nitride semiconductor layer, the step of dry etching the back surface of the GaN substrate subjected to the above-mentioned polishing by using a gas mixture of chlorine and oxygen, and the step of forming an n-type electrode on the back surface of the GaN substrate subjected to the above-mentioned dry etching.
Public/Granted literature
- US20060003490A1 Method of manufacturing nitride semiconductor device Public/Granted day:2006-01-05
Information query
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