Invention Grant
US07378713B2 Semiconductor devices with dual-metal gate structures and fabrication methods thereof
有权
具有双金属栅极结构的半导体器件及其制造方法
- Patent Title: Semiconductor devices with dual-metal gate structures and fabrication methods thereof
- Patent Title (中): 具有双金属栅极结构的半导体器件及其制造方法
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Application No.: US11552704Application Date: 2006-10-25
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Publication No.: US07378713B2Publication Date: 2008-05-27
- Inventor: Peng-Fu Hsu , Fong-Yu Yen , Yi-Shien Mor , Huan-Just Lin , Ying Jin , Hun-Jan Tao
- Applicant: Peng-Fu Hsu , Fong-Yu Yen , Yi-Shien Mor , Huan-Just Lin , Ying Jin , Hun-Jan Tao
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Thomas, Kayden, Horstemeyer & Risley
- Main IPC: H01L27/092
- IPC: H01L27/092 ; H01L29/423

Abstract:
Semiconductor devices with dual-metal gate structures and fabrication methods thereof. A semiconductor substrate with a first doped region and a second doped region separated by an insulation layer is provided. A first metal gate stack is formed on the first doped region, and a second metal gate stack is formed on the second doped region. A sealing layer is disposed on sidewalls of the first gate stack and the second gate stack. The first metal gate stack comprises an interfacial layer, a high-k dielectric layer on the interfacial layer, a first metal layer on the high-k dielectric layer, a metal insertion layer on the first metal layer, a second metal layer on the metal insertion layer, and a polysilicon layer on the second metal layer. The second metal gate stack comprises an interfacial layer, a high-k dielectric layer on the interfacial layer, a second metal layer on the high-k dielectric layer, and a polysilicon layer on the second metal layer.
Public/Granted literature
- US20080099851A1 SEMICONDUCTOR DEVICES WITH DUAL-METAL GATE STRUCTURES AND FABRICATION METHODS THEREOF Public/Granted day:2008-05-01
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