发明授权
- 专利标题： Electronic component mounting package and package assembled substrate
- 专利标题（中）： 电子元件安装封装和封装组装基板
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申请号： US11389330申请日： 2006-03-27
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公开(公告)号： US07378728B2公开(公告)日： 2008-05-27
- 发明人: Hideki Ito , Masanori Hongo , Masami Fukuyama , Hiroyuki Taguchi , Hideki Takagi
- 申请人： Hideki Ito , Masanori Hongo , Masami Fukuyama , Hiroyuki Taguchi , Hideki Takagi
- 申请人地址： JP Osaka
- 专利权人： Sanyo Electric Co., Ltd.
- 当前专利权人： Sanyo Electric Co., Ltd.
- 当前专利权人地址： JP Osaka
- 代理机构： Westerman, Hattori, Daniels & Adrian, LLP.
- 优先权： JP2005-104956 20050331
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
A package of the present invention has a laminate structure of a plurality of ceramic layers, and includes a cavity for housing a light emitting element. A mount surface is defined on a side surface parallel with the depth direction of the cavity. A pair of external electrodes each including a charged electrode portion and a coated electrode portion are formed over the entire length in the laminating direction at two corners defined by intersection of the mount surface and two side surfaces perpendicular to the mount surface. When the package is mounted, a pair of charged electrode portions and a pair of coated electrode portions are soldered to a surface of a substrate.
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