公开(公告)号：US20100246135A1

公开(公告)日：2010-09-30

申请号：US12731827

申请日：2010-03-25

申请人： Masanori Hongo ,  Takuma Hitomi ,  Hideki Ito ,  Kiyoshi Yamakoshi ,  Masami Fukuyama ,  Hideki Takagi

发明人： Masanori Hongo ,  Takuma Hitomi ,  Hideki Ito ,  Kiyoshi Yamakoshi ,  Masami Fukuyama ,  Hideki Takagi

IPC分类号： H05K7/20

CPC分类号： H01L23/3677 ,  H01L23/12 ,  H01L23/49805 ,  H01L23/49822 ,  H01L24/45 ,  H01L24/48 ,  H01L33/486 ,  H01L33/642 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/73265 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An electronic device of the present invention includes: a base made of a ceramic material; an electronic device element arranged in a central area of the upper surface of the base, in a way that the electronic device element is placed on a first heat transfer layer; a first heat dissipation layer formed in a central area of the lower surface of the base; a plurality of thermal vias arranged in the base, and which connects the first heat transfer layer and the first heat dissipation layer; and a second heat transfer layer buried in the base, the second heat transfer layer crossing the plurality of thermal vias, while extending from a position above a central area of the lower surface of the base to a position above a peripheral area of the lower surface of the base.

摘要翻译： 本发明的电子设备包括：由陶瓷材料制成的基座; 电子器件元件，其布置在所述基座的上表面的中心区域中，以使得所述电子器件元件被放置在第一传热层上; 第一散热层，形成在所述基部的下表面的中心区域; 多个热通孔，其布置在所述基座中，并且连接所述第一传热层和所述第一散热层; 以及第二传热层，所述第二传热层与所述多个热通孔交叉，同时从所述基部的下表面的中心区域上方的位置延伸到所述下表面的周边区域的上​​方 的基地。

公开(公告)号：US20060220205A1

公开(公告)日：2006-10-05

申请号：US11374138

申请日：2006-03-14

申请人： Masanori Hongo ,  Masami Fukuyama

发明人： Masanori Hongo ,  Masami Fukuyama

IPC分类号： H01L23/02

CPC分类号： H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/12041 ,  H01L2924/00014

摘要： A package of the present invention has a laminate structure formed by laminating a plurality of ceramic layers, and has a mount surface to be a joint surface when mounted on a mother board, defined parallel with the laminating direction. A first ceramic layer has a recess with an L-shaped cross section across the mount surface and a side surface, defined at each end thereof in a direction perpendicular to the laminating direction, and an external electrode formed on each recess, the external electrode having a surface thereof exposed to the mount surface.

摘要翻译： 本发明的封装具有通过层叠多个陶瓷层而形成的层叠结构，并且在与层叠方向平行地限定在安装在母板上时具有作为接合面的安装面。 第一陶瓷层具有穿过安装表面的L形横截面的凹部和在其每个端部沿与层叠方向垂直的方向限定的侧表面和形成在每个凹部上的外部电极，所述外部电极具有 其表面暴露于安装表面。

公开(公告)号：US07432590B2

公开(公告)日：2008-10-07

申请号：US11198135

申请日：2005-08-08

申请人： Natsuyo Nagano ,  Takashi Ogura ,  Masanori Hongo ,  Masami Fukuyama

发明人： Natsuyo Nagano ,  Takashi Ogura ,  Masanori Hongo ,  Masami Fukuyama

IPC分类号： H01L23/12 ,  H01L23/48

CPC分类号： H01L21/50 ,  H01L21/4807 ,  H01L23/13 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： In a ceramic package including one or more ceramic layers and being capable of having an electronic component and a lid fixed to a surface thereof, a surface of a ceramic layer having a sealing electrode for joining the lid through a sealing member and a pad to be connected to input and output electrodes and/or a ground electrode of the electronic component is divided into an inner portion having the pad and an outer portion having the sealing electrode with a stepped side wall as a border for preventing the sealing member from flowing, and one of the inner portion and the outer portion projects relative to the other.

摘要翻译： 在包括一个或多个陶瓷层并且能够将电子部件和固定在其表面上的盖的陶瓷封装中的陶瓷层的表面上，具有密封电极的表面，所述密封电极用于通过密封构件和垫将盖接合， 连接到电子部件的输入和输出电极和/或接地电极被分成具有焊盘的内部部分和具有密封电极的外部部分，其具有阶梯状侧壁作为防止密封部件流动的边界，以及 内部部分和外部部分中的一个相对于另一个突出。

公开(公告)号：US20060220233A1

公开(公告)日：2006-10-05

申请号：US11389330

申请日：2006-03-27

申请人： Hideki Ito ,  Masanori Hongo ,  Masami Fukuyama ,  Hiroyuki Taguchi ,  Hideki Takagi

发明人： Hideki Ito ,  Masanori Hongo ,  Masami Fukuyama ,  Hiroyuki Taguchi ,  Hideki Takagi

IPC分类号： H01L23/34

CPC分类号： H05K3/3442 ,  H01L21/4857 ,  H01L23/15 ,  H01L23/49805 ,  H01L24/97 ,  H01L33/486 ,  H01L33/62 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H05K2201/09472 ,  H05K2201/09845 ,  H05K2201/10106 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

摘要： A package of the present invention has a laminate structure of a plurality of ceramic layers, and includes a cavity for housing a light emitting element. A mount surface is defined on a side surface parallel with the depth direction of the cavity. A pair of external electrodes each including a charged electrode portion and a coated electrode portion are formed over the entire length in the laminating direction at two corners defined by intersection of the mount surface and two side surfaces perpendicular to the mount surface. When the package is mounted, a pair of charged electrode portions and a pair of coated electrode portions are soldered to a surface of a substrate.

摘要翻译： 本发明的封装具有多个陶瓷层的叠层结构，并且包括用于容纳发光元件的空腔。 安装表面限定在与空腔的深度方向平行的侧表面上。 在安装面和与安装面垂直的两个侧面的交点形成的两个角处，在层叠方向的整个长度上形成有一对包含带电电极部分和涂覆电极部分的外部电极。 当安装封装时，将一对充电电极部分和一对涂覆的电极部分焊接到基板的表面。

公开(公告)号：US20060115637A1

公开(公告)日：2006-06-01

申请号：US10541494

申请日：2004-09-27

申请人： Masanori Hongo ,  Hiroyuki Nishikiori ,  Natsuyo Nagano ,  Takashi Ogura

发明人： Masanori Hongo ,  Hiroyuki Nishikiori ,  Natsuyo Nagano ,  Takashi Ogura

IPC分类号： B32B17/00

CPC分类号： H01L23/49805 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K1/0306 ,  H05K3/0052 ,  H05K3/403 ,  H05K3/4061 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/0919 ,  Y10T29/4913 ,  Y10T428/24777 ,  Y10T428/24926 ,  H01L2924/00014

摘要： A laminated ceramic substrate includes a side electrode in which a side edge electrode layer formed on a side edge portion of a ceramic layer overlaps with and connects to a side edge electrode layer formed on a side edge portion of another ceramic layer directly above and/or directly below the former ceramic layer. The side edge electrode layer includes a parallel wall unexposed and approximately parallel to a side surface of the laminated ceramic substrate and a perpendicular wall approximately perpendicular to the side surface of the laminated ceramic substrate. A length La of the parallel wall and a depth Lb of the parallel wall from the side surface of the laminated ceramic substrate have a relationship of La>Lb.

摘要翻译： 层叠陶瓷基板包括侧面电极，其中形成在陶瓷层的侧边缘部分上的侧边缘电极层与形成在另一陶瓷层的侧边缘部分上的侧边缘电极层重叠并连接到另一陶瓷层的正上方和/或 直接在以前的陶瓷层下面。 侧边电极层包括未曝光并且大致平行于层叠陶瓷基板的侧表面的平行壁和大致垂直于层叠陶瓷基板的侧表面的垂直壁。 平行壁的长度La和层叠陶瓷基板的侧面的平行壁的深度Lb具有La> Lb的关系。

公开(公告)号：US20050141396A1

公开(公告)日：2005-06-30

申请号：US11019615

申请日：2004-12-23

申请人： Masanori Hongo ,  Masami Fukuyama ,  Takashi Ogura

发明人： Masanori Hongo ,  Masami Fukuyama ,  Takashi Ogura

IPC分类号： G11B11/00 ,  H01L33/48 ,  H01L33/62

CPC分类号： H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15174 ,  H01L2924/00014

摘要： The present invention provides a package for light emitting element having a base substrate and a frame body mounted on an upper surface of the base substrate to form a cavity for housing a light emitting element therein. The frame body has an inner peripheral surface formed with a first reflecting layer. Furthermore, the base substrate has an upper surface formed with a pair of land layers for mounting the light emitting element thereon. One of the land layers has an outer peripheral portion connected to a lower end portion of the reflecting layer. The other land layer includes an exposure portion exposed on the upper surface of the base substrate, and a buried portion buried inside the base substrate. Further, the base substrate has a second reflecting layer formed below an area exposed on the bottom surface of the cavity.

摘要翻译： 本发明提供了一种用于发光元件的封装，其具有基底基板和安装在基底基板的上表面上的框体，以形成用于将发光元件容纳在其中的空腔。 框体具有形成有第一反射层的内周面。 此外，基底基板具有形成有用于将发光元件安装在其上的一对接地层的上表面。 一个接地层具有连接到反射层的下端部的外周部。 另一个地面层包括暴露在基底基板的上表面上的曝光部分和埋在基底内的掩埋部分。 此外，基底基板具有形成在暴露在空腔的底表面上的区域下方的第二反射层。

公开(公告)号：US20050116789A1

公开(公告)日：2005-06-02

申请号：US10992642

申请日：2004-11-22

申请人： Masanori Hongo ,  Natsuyo Nagano ,  Takashi Ogura ,  Hideki Ito ,  Toshio Tanuma

发明人： Masanori Hongo ,  Natsuyo Nagano ,  Takashi Ogura ,  Hideki Ito ,  Toshio Tanuma

IPC分类号： H03H9/72 ,  H01P1/213 ,  H03H9/25

CPC分类号： H01P1/213

摘要： The present invention provides an antenna duplexer comprising a transmitting filter and a receiving filter which are mounted on a package, a transmitting signal input pad and a transmitting signal output pad which are connected to input and output ends of the transmitting filter, a receiving signal input pad and a receiving signal output pad which are connected to input and output ends of the receiving filter, and at least one grounding pad. The pads are arranged, on a surface of the package, along at least two sides of four sides of a quadrangle. The transmitting signal input pad and the receiving signal output pad are disposed at diagonal positions of the quadrangle and are furthest away from one another.

摘要翻译： 本发明提供了一种天线双工器，其包括安装在封装上的发射滤波器和接收滤波器，发射信号输入焊盘和发射信号输出焊盘，其连接到发射滤波器的输入和输出端，接收信号输入 焊盘和接收信号输出焊盘，其连接到接收滤波器的输入和输出端，以及至少一个接地焊盘。 垫片在包装的表面上沿着四边形的四边的至少两侧布置。 发射信号输入焊盘和接收信号输出焊盘设置在四边形的对角位置处并且彼此最远。

公开(公告)号：US07777314B2

公开(公告)日：2010-08-17

申请号：US11374138

申请日：2006-03-14

申请人： Masanori Hongo ,  Masami Fukuyama

发明人： Masanori Hongo ,  Masami Fukuyama

IPC分类号： H01L23/02

CPC分类号： H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/12041 ,  H01L2924/00014

摘要： A package of the present invention has a laminate structure formed by laminating a plurality of ceramic layers, and has a mount surface to be a joint surface when mounted on a mother board, defined parallel with the laminating direction. A first ceramic layer has a recess with an L-shaped cross section across the mount surface and a side surface, defined at each end thereof in a direction perpendicular to the laminating direction, and an external electrode formed on each recess, the external electrode having a surface thereof exposed to the mount surface.

摘要翻译： 本发明的封装具有通过层叠多个陶瓷层而形成的层叠结构，并且在与层叠方向平行地限定在安装在母板上时具有作为接合面的安装面。 第一陶瓷层具有穿过安装表面的L形横截面的凹部和在其每个端部沿与层叠方向垂直的方向限定的侧表面和形成在每个凹部上的外部电极，所述外部电极具有 其表面暴露于安装表面。

公开(公告)号：US07218002B2

公开(公告)日：2007-05-15

申请号：US11030288

申请日：2005-01-07

申请人： Natsuyo Nagano ,  Masanori Hongo ,  Masami Fukuyama ,  Takashi Ogura

发明人： Natsuyo Nagano ,  Masanori Hongo ,  Masami Fukuyama ,  Takashi Ogura

IPC分类号： H01L23/04

CPC分类号： H01L23/49805 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K3/0052 ,  H05K3/3442 ,  H05K3/368 ,  H05K3/403 ,  H05K2201/09154 ,  H05K2201/10727 ,  Y02P70/613 ,  H01L2924/00014

摘要： The present invention provides an electronic device comprising a base substrate to be surface-mounted on a circuit board, one or more electronic component elements mounted on a surface of the base substrate and/or therein, an external electrode provided on an end portion of the base substrate and in the form of a post perpendicular to a rear surface of the base substrate for connecting the one or more electronic component elements to the circuit board. Furthermore, the base substrate is provided on its end portion with a slope crossing a side surface and a rear surface of the base substrate. A surface of the external electrode is exposed on the slope.

摘要翻译： 本发明提供一种电子装置，其特征在于，具备：表面安装在电路基板上的基底基板，安装在所述基板的表面上的一个或多个电子元件元件和/或其内部设置在所述基板的端部的外部电极 并且以垂直于基底基板的后表面的柱的形式，用于将一个或多个电子元件连接到电路板。 此外，基底在其端部设置有与基底的侧面和背面交叉的斜面。 外部电极的表面暴露在斜面上。

公开(公告)号：US07180387B2

公开(公告)日：2007-02-20

申请号：US10992644

申请日：2004-11-22

申请人： Masanori Hongo ,  Natsuyo Nagano ,  Takashi Ogura ,  Hideki Ito ,  Toshio Tanuma

发明人： Masanori Hongo ,  Natsuyo Nagano ,  Takashi Ogura ,  Hideki Ito ,  Toshio Tanuma

IPC分类号： H01P1/213 ,  H03H9/72

CPC分类号： H03H9/0576 ,  H03H9/72 ,  H03H9/725

摘要： The present invention provides an antenna duplexer comprising a package having a plurality of ceramic layers superposed, and a transmitting filter and a receiving filter which are mounted on a surface of the package. A phase-matching strip line is formed on a surface of one ceramic layer. The package has grounding layers formed respectively on surfaces of upper and lower ceramic layers with the phase-matching strip line interposed therebetween. A plurality of via holes are formed around the phase-matching strip line for connecting the two grounding layers to each other.

摘要翻译： 本发明提供了一种天线双工器，其包括叠置有多个陶瓷层的封装，以及安装在封装表面上的发射滤波器和接收滤波器。 在一个陶瓷层的表面上形成相位匹配带状线。 该封装具有分别形成在上部和下部陶瓷层的表面上的接地层，并且相互匹配的带状线插入其间。 在相匹配带状线周围形成多个通孔，用于将两个接地层彼此连接。