Invention Grant
- Patent Title: Electronic component mounting package and package assembled substrate
- Patent Title (中): 电子元件安装封装和封装组装基板
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Application No.: US11389330Application Date: 2006-03-27
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Publication No.: US07378728B2Publication Date: 2008-05-27
- Inventor: Hideki Ito , Masanori Hongo , Masami Fukuyama , Hiroyuki Taguchi , Hideki Takagi
- Applicant: Hideki Ito , Masanori Hongo , Masami Fukuyama , Hiroyuki Taguchi , Hideki Takagi
- Applicant Address: JP Osaka
- Assignee: Sanyo Electric Co., Ltd.
- Current Assignee: Sanyo Electric Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: Westerman, Hattori, Daniels & Adrian, LLP.
- Priority: JP2005-104956 20050331
- Main IPC: H01L23/48
- IPC: H01L23/48

Abstract:
A package of the present invention has a laminate structure of a plurality of ceramic layers, and includes a cavity for housing a light emitting element. A mount surface is defined on a side surface parallel with the depth direction of the cavity. A pair of external electrodes each including a charged electrode portion and a coated electrode portion are formed over the entire length in the laminating direction at two corners defined by intersection of the mount surface and two side surfaces perpendicular to the mount surface. When the package is mounted, a pair of charged electrode portions and a pair of coated electrode portions are soldered to a surface of a substrate.
Public/Granted literature
- US20060220233A1 Electronic component mounting package and package assembled substrate Public/Granted day:2006-10-05
Information query
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