发明授权
- 专利标题： Base pad polishing pad and multi-layer pad comprising the same
- 专利标题（中）： 基座抛光垫和包括该基板的多层衬垫
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申请号： US10580617申请日： 2005-02-16
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公开(公告)号： US07381121B2公开(公告)日： 2008-06-03
- 发明人: Eu-Gene Song , Ju-Yeol Lee , Sung-Min Kim , Jae-Seok Kim , Hyun-Woo Lee
- 申请人： Eu-Gene Song , Ju-Yeol Lee , Sung-Min Kim , Jae-Seok Kim , Hyun-Woo Lee
- 申请人地址： KR Kyungki-do
- 专利权人： SKC Co., Ltd.
- 当前专利权人： SKC Co., Ltd.
- 当前专利权人地址： KR Kyungki-do
- 代理机构： Abelman, Frayne & Schwab
- 优先权： KR10-2004-0010492 20040217; KR10-2004-0016402 20040311
- 国际申请： PCT/KR2005/000441 WO 20050216
- 国际公布： WO2005/077602 WO 20050825
- 主分类号： B24D11/00
- IPC分类号： B24D11/00
摘要：
Disclosed is a base pad of polishing pad, which is used in conjunction with polishing slurry during a chemical-mechanical polishing or planarizing process, and a multilayer pad using the same. Since the base pad according to the present invention does not have fine pores, it is possible to prevent permeation of polishing slurry and water and to avoid non uniformity of physical properties. Thereby, it is possible to lengthen the lifetime of the polishing pad.
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