公开(公告)号：US07381121B2

公开(公告)日：2008-06-03

申请号：US10580617

申请日：2005-02-16

申请人： Eu-Gene Song ,  Ju-Yeol Lee ,  Sung-Min Kim ,  Jae-Seok Kim ,  Hyun-Woo Lee

发明人： Eu-Gene Song ,  Ju-Yeol Lee ,  Sung-Min Kim ,  Jae-Seok Kim ,  Hyun-Woo Lee

IPC分类号： B24D11/00

CPC分类号： B24D11/02 ,  B24B37/22

摘要： Disclosed is a base pad of polishing pad, which is used in conjunction with polishing slurry during a chemical-mechanical polishing or planarizing process, and a multilayer pad using the same. Since the base pad according to the present invention does not have fine pores, it is possible to prevent permeation of polishing slurry and water and to avoid non uniformity of physical properties. Thereby, it is possible to lengthen the lifetime of the polishing pad.

摘要翻译： 公开了一种在化学机械抛光或平面化处理过程中与抛光浆料结合使用的抛光垫的基垫，以及使用其的多层垫。 由于根据本发明的基垫不具有细孔，因此可以防止研磨浆和水的渗透，并且可以避免物理性质的不均匀。 由此，可以延长抛光垫的寿命。

公开(公告)号：US20070254564A1

公开(公告)日：2007-11-01

申请号：US10580617

申请日：2005-02-16

申请人： Eu-Gene Song ,  Ju-Yeol Lee ,  Sung-Min Kim ,  Jae-Seok Kim ,  Hyun-Woo Lee

发明人： Eu-Gene Song ,  Ju-Yeol Lee ,  Sung-Min Kim ,  Jae-Seok Kim ,  Hyun-Woo Lee

IPC分类号： B24D11/00

CPC分类号： B24D11/02 ,  B24B37/22

摘要： Disclosed is a base pad of polishing pad, which is used in conjunction with polishing slurry during a chemical-mechanical polishing or planarizing process, and a multilayer pad using the same. Since the base pad according to the present invention does not have fine pores, it is possible to prevent premeation of polishing slurry and water and to avoid nonuniformity of physical properties. Thereby, it is possible to lengthen the lifetime of the polishing pad.

摘要翻译： 公开了一种在化学机械抛光或平面化处理过程中与抛光浆料结合使用的抛光垫的基垫，以及使用其的多层垫。 由于根据本发明的基底垫不具有细孔，因此可以防止研磨浆料和水的前体化，并且避免物理性能的不均匀性。 由此，可以延长抛光垫的寿命。