Invention Grant
- Patent Title: Semiconductor device and method of forming a semiconductor device
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US11873966Application Date: 2007-10-17
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Publication No.: US07381606B2Publication Date: 2008-06-03
- Inventor: Florin Udrea
- Applicant: Florin Udrea
- Applicant Address: GB Cambridge
- Assignee: Cambridge Semiconductor Limited
- Current Assignee: Cambridge Semiconductor Limited
- Current Assignee Address: GB Cambridge
- Agency: Pillsbury Winthrop Shaw Pittman LLP
- Main IPC: H01L21/336
- IPC: H01L21/336 ; H01L21/8234 ; H01L21/8238

Abstract:
A bipolar high voltage/power semiconductor device has a low voltage terminal and a high voltage terminal. The device has a drift region of a first conductivity type and having first and second ends. In one example, a region of the second conductivity type is provided at the second end of the drift region connected directly to the high voltage terminal. In another example, a buffer region of the first conductivity type is provided at the second end of the drift region and a region of a second conductivity type is provided on the other side of the buffer region and connected to the high voltage terminal. Plural electrically floating island regions are provided within the drift region at or towards the second end of the drift region, the plural electrically floating island regions being of the first conductivity type and being more highly doped than the drift region.
Public/Granted literature
- US20080070350A1 SEMICONDUCTOR DEVICE AND METHOD OF FORMING A SEMICONDUCTOR DEVICE Public/Granted day:2008-03-20
Information query
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