Invention Grant
US07384807B2 Method of fabricating vertical structure compound semiconductor devices 失效
制造垂直结构化合物半导体器件的方法

  • Patent Title: Method of fabricating vertical structure compound semiconductor devices
  • Patent Title (中): 制造垂直结构化合物半导体器件的方法
  • Application No.: US10861743
    Application Date: 2004-06-03
  • Publication No.: US07384807B2
    Publication Date: 2008-06-10
  • Inventor: Myung Cheol Yoo
  • Applicant: Myung Cheol Yoo
  • Applicant Address: US CA Dublin
  • Assignee: Verticle, Inc.
  • Current Assignee: Verticle, Inc.
  • Current Assignee Address: US CA Dublin
  • Agency: IPSG, P.C.
  • Main IPC: H01L21/00
  • IPC: H01L21/00
Method of fabricating vertical structure compound semiconductor devices
Abstract:
A method of fabricating a vertical structure opto-electronic device includes fabricating a plurality of vertical structure opto-electronic devices on a crystal substrate, and then removing the substrate using a laser lift-off process. The method then fabricates a metal support structure in place of the substrate. In one aspect, the step of fabricating a metal support structure in place of the substrate includes the step of plating the metal support structure using at least one of electroplating and electro-less plating. In one aspect, the vertical structure is a GaN-based vertical structure, the crystal substrate includes sapphire and the metal support structure includes copper. Advantages of the invention include fabricating vertical structure LEDs suitable for mass production with high reliability and high yield.
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