发明授权
- 专利标题: Semiconductor device and a method of manufacturing the same
- 专利标题(中): 半导体装置及其制造方法
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申请号: US11642523申请日: 2006-12-21
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公开(公告)号: US07385279B2公开(公告)日: 2008-06-10
- 发明人: Toshinori Hirashima , Munehisa Kishimoto , Toshiyuki Hata , Yasushi Takahashi
- 申请人: Toshinori Hirashima , Munehisa Kishimoto , Toshiyuki Hata , Yasushi Takahashi
- 申请人地址: JP Tokyo
- 专利权人: Renesas Technology Corp.
- 当前专利权人: Renesas Technology Corp.
- 当前专利权人地址: JP Tokyo
- 代理机构: Mattingly, Stanger, Malur & Brundidge, PC
- 优先权: JP11-38124 19990217; JP11-372510 19991228
- 主分类号: H01L23/495
- IPC分类号: H01L23/495 ; H01L23/48 ; H01L23/52
摘要:
A semiconductor device and method having high output and having reduced external resistance is reduced and improved radiating performance. A MOSFET (70) has a connecting portion for electrically connecting a surface electrode of a semiconductor pellet and a plurality of inner leads, a resin encapsulant (29), a plurality of outer leads (37), (38) protruding in parallel from the same lateral surface of the resin encapsulant (29) and a header (28) bonded to a back surface of the semiconductor pellet and having a header protruding portion (28c) protruding from a lateral surface of the resin encapsulant (29) opposite to the lateral surface from which the outer leads protrude, wherein the header (28) has an exposed surface (28b) exposed from the resin encapsulant (29); the outer leads (37), (38) are bent; and the exposed of the outer leads (37), (38) are provided at substantially the same height.
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