Invention Grant
US07387827B2 Interconnection designs and materials having improved strength and fatigue life
有权
互连设计和材料具有改善的强度和疲劳寿命
- Patent Title: Interconnection designs and materials having improved strength and fatigue life
- Patent Title (中): 互连设计和材料具有改善的强度和疲劳寿命
-
Application No.: US10427168Application Date: 2003-04-30
-
Publication No.: US07387827B2Publication Date: 2008-06-17
- Inventor: Terry Lee Sterrett , Richard J. Harries
- Applicant: Terry Lee Sterrett , Richard J. Harries
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Marger Johnson & McCollom, P.C.
- Main IPC: B32B3/10
- IPC: B32B3/10 ; H01L23/48
Abstract:
Methods and designs for increasing interconnect areas for interconnect bumps are disclosed. An interconnect bump may be formed on a substrate such that the interconnect bump extends beyond a contact pad onto a substrate. An interconnect bump may be formed on a larger contact pad, the bump having a large diameter.
Public/Granted literature
- US20040115409A1 Interconnection designs and materials having improved strength and fatigue life Public/Granted day:2004-06-17
Information query
