Invention Grant
- Patent Title: Application of a thermally conductive thin film to a wafer backside prior to dicing to prevent chipping and cracking
- Patent Title (中): 在切割之前将导热薄膜应用于晶片背面以防止碎裂和开裂
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Application No.: US10990778Application Date: 2004-11-16
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Publication No.: US07387911B2Publication Date: 2008-06-17
- Inventor: David M Audette , Steven R. Codding , Timothy C. Krywanczyk , Brian J. Thibault , Matthew R. Whalen
- Applicant: David M Audette , Steven R. Codding , Timothy C. Krywanczyk , Brian J. Thibault , Matthew R. Whalen
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, PC
- Agent William H. Steinberg
- Main IPC: H01L21/50
- IPC: H01L21/50 ; H01L21/48 ; H01L21/44 ; H01L21/46 ; H01L23/544 ; H01L21/768 ; H01L21/78
Abstract:
A thermally conductive protective film or layer is applied to the backside surface of a semiconductor wafer prior to a subsequent dicing operation performed on the wafer to singulate the wafer into diced semiconductor chips, during which the thin thermally conductive film minimizes and prevents chipping and cracking damage to the wafer and diced chips. During subsequent electrical operation of a diced chip, the thin thermally conductive film functions as a thermal conductor to dissipate and conduct away to a heat sink any heat generated during operation of the chip.
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