发明授权
US07387951B2 Method of dicing semiconductor wafer into chips, and apparatus using this method
失效
将半导体晶片切割成芯片的方法，以及使用该方法的装置
- 专利标题： Method of dicing semiconductor wafer into chips, and apparatus using this method
- 专利标题（中）： 将半导体晶片切割成芯片的方法，以及使用该方法的装置
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申请号： US11084133申请日： 2005-03-21
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公开(公告)号： US07387951B2公开(公告)日： 2008-06-17
- 发明人: Masayuki Yamamoto , Saburo Miyamoto
- 申请人： Masayuki Yamamoto , Saburo Miyamoto
- 申请人地址： JP Osaka
- 专利权人： Nitto Denko Corporation
- 当前专利权人： Nitto Denko Corporation
- 当前专利权人地址： JP Osaka
- 代理机构： Cheng Law Group PLLC
- 优先权： JP2004-096056 20040329
- 主分类号： H01L21/00
- IPC分类号： H01L21/00
摘要：
The invention relates to a semiconductor wafer dicing method of dicing a semiconductor wafer along parting lines into chips. The semiconductor wafer in which parting lines along which the semiconductor wafer is diced into chips are formed is held by an adhesive tape. By radially drawing the adhesive tape in a state where the chips in the semiconductor wafer are not parted from each other, the chips are parted from each other and clearances among the chips are extended.
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