Invention Grant
US07388172B2 System and method for cutting using a variable astigmatic focal beam spot
有权
使用可变散光焦点光斑切割的系统和方法
- Patent Title: System and method for cutting using a variable astigmatic focal beam spot
- Patent Title (中): 使用可变散光焦点光斑切割的系统和方法
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Application No.: US10782741Application Date: 2004-02-19
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Publication No.: US07388172B2Publication Date: 2008-06-17
- Inventor: Patrick J. Sercel , Jeffrey P. Sercel , Jongkook Park
- Applicant: Patrick J. Sercel , Jeffrey P. Sercel , Jongkook Park
- Applicant Address: US NH Macnchester
- Assignee: J.P. Sercel Associates, Inc.
- Current Assignee: J.P. Sercel Associates, Inc.
- Current Assignee Address: US NH Macnchester
- Agency: Grossman Tucker Perreault & Pfleger, PLLC
- Main IPC: B23K26/00
- IPC: B23K26/00

Abstract:
A variable astigmatic focal beam spot is formed using lasers with an anamorphic beam delivery system. The variable astigmatic focal beam spot can be used for cutting applications, for example, to scribe semiconductor wafers such as light emitting diode (LED) wafers. The exemplary anamorphic beam delivery system comprises a series of optical components, which deliberately introduce astigmatism to produce focal points separated into two principal meridians, i.e. vertical and horizontal. The astigmatic focal points result in an asymmetric, yet sharply focused, beam spot that consists of sharpened leading and trailing edges. Adjusting the astigmatic focal points changes the aspect ratio of the compressed focal beam spot, allowing adjustment of energy density at the target without affecting laser output power. Scribing wafers with properly optimized energy and power density increases scribing speeds while minimizing excessive heating and collateral material damage.
Public/Granted literature
- US20040228004A1 System and method for cutting using a variable astigmatic focal beam spot Public/Granted day:2004-11-18
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