发明授权
- 专利标题： Interposer method of fabricating same, and semiconductor device using the same having two portions with different constructions
- 专利标题（中）： 其制造方法是使用具有不同构造的两部分的半导体装置
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申请号： US11151193申请日： 2005-06-14
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公开(公告)号： US07388293B2公开(公告)日： 2008-06-17
- 发明人: Katsuya Fukase , Shinichi Wakabayashi
- 申请人： Katsuya Fukase , Shinichi Wakabayashi
- 申请人地址： JP Nagano-shi
- 专利权人： Shinko Electric Industries, Co.
- 当前专利权人： Shinko Electric Industries, Co.
- 当前专利权人地址： JP Nagano-shi
- 代理机构： Edwards Angell Palmer & Dodge LLP
- 优先权： JP2004-193490 20040630
- 主分类号： H01L23/52
- IPC分类号： H01L23/52 ; H01L23/48
摘要：
An interposer to be interposed between a semiconductor chip to be mounted thereon and a packaging board has an interposer portion made of a semiconductor material and an interposer portion provided around the foregoing interposer portion integrally therewith. On both surfaces of the interposer portions, wiring patterns are formed via insulating layers. The wiring patterns are electrically connected via through holes formed at required positions in the interposer portions. The outer interposer portion is made of an insulator or a metal body. Further, external connection terminals are bonded to one surface of the interposer.
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