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1.发明授权公开(公告)号：US07388293B2
公开(公告)日：2008-06-17
申请号：US11151193
申请日：2005-06-14
CPC分类号： H01L23/147 , H01L21/6835 , H01L23/14 , H01L23/3677 , H01L23/492 , H01L23/49827 , H01L25/0657 , H01L2224/16225 , H01L2225/06517 , H01L2225/0652 , H01L2225/06541 , H01L2225/06572 , H01L2924/00011 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/10253 , H01L2924/15311 , H01L2924/15331 , H01L2924/3511 , Y10T29/49117 , Y10T29/49126 , Y10T29/49144 , Y10T29/49155 , Y10T29/49165 , H01L2924/00 , H01L2224/0401
摘要： An interposer to be interposed between a semiconductor chip to be mounted thereon and a packaging board has an interposer portion made of a semiconductor material and an interposer portion provided around the foregoing interposer portion integrally therewith. On both surfaces of the interposer portions, wiring patterns are formed via insulating layers. The wiring patterns are electrically connected via through holes formed at required positions in the interposer portions. The outer interposer portion is made of an insulator or a metal body. Further, external connection terminals are bonded to one surface of the interposer.
摘要翻译： 插入在要安装在其上的半导体芯片与封装板之间的插入器具有由半导体材料制成的插入件部分和与其整体设置在所述插入件部分周围的插入部分。 在内插器部分的两个表面上，经由绝缘层形成布线图案。 布线图案通过形成在插入件部分中的所需位置的通孔电连接。 外部插入部由绝缘体或金属体构成。 此外，外部连接端子被接合到插入器的一个表面。
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公开(公告)号：US5909053A
公开(公告)日：1999-06-01
申请号：US761360
申请日：1996-12-09
IPC分类号： H01L23/50 , H01L21/48 , H01L23/495 , H05K3/20 , H05K3/34
CPC分类号： H01L21/4821 , H01L23/49534 , H01L23/49541 , H01L23/49548 , H01L23/49582 , H01L2224/48091 , H01L2224/48247 , H01L24/48 , H01L2924/00014 , H01L2924/01078 , H01L2924/181 , H05K3/20 , H05K3/202 , H05K3/205 , H05K3/3421
摘要： In a method for manufacturing a lead frame, a predetermined pattern is formed on a matrix 10 by a resist, an electro-deposition portion is provided in a cavity formed in the resist patterns 12, and the electrodeposition pattern 13 is separated from the matrix 10. The resist pattern is formed on the matrix 10 so that a cavity portion 17 connecting a plurality of cavity 16 ends for inner lead formation can be included in the resist pattern, and an electro-deposition portion is provided into the cavity portion 17 so that the electro-deposition pattern 13 can be formed into a configuration in which the tip ends of the inner leads 22 are connected by a connecting piece 21, and the electro-deposition pattern 13 is separated from the matrix 10 while the tip ends of the inner leads 22 are connected by the connecting piece 21.
摘要翻译： 在制造引线框架的方法中，通过抗蚀剂在矩阵10上形成预定图案，在形成于抗蚀图案12中的空腔中设置电沉积部分，并将电沉积图案13从矩阵10分离 抗蚀剂图形形成在矩阵10上，使得连接多个腔体16的端部用于内部引线形成的空腔部分17可以包括在抗蚀剂图案中，并且将电沉积部分设置到空腔部分17中，使得 电沉积图案13可以形成为通过连接片21连接内部引线22的前端的结构，并且电沉积图案13与基体10分离，同时内部引线22的顶端 引线22由连接片21连接。
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3.发明申请Interposer, method of fabricating the same, and semiconductor device using the same 有权内插件，其制造方法以及使用其的半导体器件公开(公告)号：US20060263937A1
公开(公告)日：2006-11-23
申请号：US11488648
申请日：2006-07-19
IPC分类号： H01L21/00
CPC分类号： H01L23/147 , H01L21/6835 , H01L23/14 , H01L23/3677 , H01L23/492 , H01L23/49827 , H01L25/0657 , H01L2224/16225 , H01L2225/06517 , H01L2225/0652 , H01L2225/06541 , H01L2225/06572 , H01L2924/00011 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/10253 , H01L2924/15311 , H01L2924/15331 , H01L2924/3511 , Y10T29/49117 , Y10T29/49126 , Y10T29/49144 , Y10T29/49155 , Y10T29/49165 , H01L2924/00 , H01L2224/0401
摘要： An interposer to be interposed between a semiconductor chip to be mounted thereon and a packaging board has an interposer portion made of a semiconductor and an interposer portion provided around the foregoing interposer portion integrally therewith. On both surfaces of the interposer portions, wiring patterns are formed via insulating layers. The wiring patterns are electrically connected via through holes formed at required positions in the interposer portions. The outer interposer portion is made of an insulator or a metal body. Further, external connection terminals are bonded to one surface of the interposer.
摘要翻译： 要安装在其上的半导体芯片和封装板之间的插入件具有由半导体制成的插入部分和与其一体设置在上述插入部分周围的插入部分。 在内插器部分的两个表面上，经由绝缘层形成布线图案。 布线图案通过形成在插入件部分中的所需位置的通孔电连接。 外部插入部由绝缘体或金属体构成。 此外，外部连接端子被接合到插入器的一个表面。
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4.发明授权Interposer, method of fabricating the same, and semiconductor device using the same 有权内插件，其制造方法以及使用其的半导体器件公开(公告)号：US07415762B2
公开(公告)日：2008-08-26
申请号：US11488648
申请日：2006-07-19
IPC分类号： H01K3/10
CPC分类号： H01L23/147 , H01L21/6835 , H01L23/14 , H01L23/3677 , H01L23/492 , H01L23/49827 , H01L25/0657 , H01L2224/16225 , H01L2225/06517 , H01L2225/0652 , H01L2225/06541 , H01L2225/06572 , H01L2924/00011 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/10253 , H01L2924/15311 , H01L2924/15331 , H01L2924/3511 , Y10T29/49117 , Y10T29/49126 , Y10T29/49144 , Y10T29/49155 , Y10T29/49165 , H01L2924/00 , H01L2224/0401
摘要： An interposer to be interposed between a semiconductor chip to be mounted thereon and a packaging board has an interposer portion made of a semiconductor and an interposer portion provided around the foregoing interposer portion integrally therewith. On both surfaces of the interposer portions, wiring patterns are formed via insulating layers. The wiring patterns are electrically connected via through holes formed at required positions in the interposer portions. The outer interposer portion is made of an insulator or a metal body. Further, external connection terminals are bonded to one surface of the interposer.
摘要翻译： 要安装在其上的半导体芯片和封装板之间的插入件具有由半导体制成的插入部分和与其一体设置在上述插入部分周围的插入部分。 在内插器部分的两个表面上，经由绝缘层形成布线图案。 布线图案通过形成在插入件部分中的所需位置的通孔电连接。 外部插入部由绝缘体或金属体构成。 此外，外部连接端子被接合到插入器的一个表面。
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公开(公告)号：US5643433A
公开(公告)日：1997-07-01
申请号：US172286
申请日：1993-12-23
CPC分类号： H01L21/4821 , H01L23/49534 , H01L23/49541 , H01L23/49548 , H01L23/49582 , H01L2224/48091 , H01L2224/48247 , H01L24/48 , H01L2924/00014 , H01L2924/01078 , H01L2924/181 , H05K3/20 , H05K3/202 , H05K3/205 , H05K3/3421
摘要： A method for manufacturing a lead frame employing a resist pattern formed on a matrix and having a cavity therein, in which an electro-deposition pattern is formed. A connecting cavity portion interconnects tip ends of inner lead cavity portions such that a connecting portion interconnects the tip ends of inner leads of the electro-deposition pattern formed in the cavity. The connecting piece is maintained while the electro-deposition pattern is separated from the matrix and the resist.
摘要翻译： 一种制造引线框架的方法，该引线框采用形成在基体上并在其中形成有空穴的抗蚀剂图案，其中形成电沉积图案。 连接腔部分将内部引线腔部分的末端互连，使得连接部分将形成在腔中的电沉积图案的内部引线的末端相互连接。 当电沉积图案与基体和抗蚀剂分离时，保持连接件。
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公开(公告)号：US20060001179A1
公开(公告)日：2006-01-05
申请号：US11151193
申请日：2005-06-14
CPC分类号： H01L23/147 , H01L21/6835 , H01L23/14 , H01L23/3677 , H01L23/492 , H01L23/49827 , H01L25/0657 , H01L2224/16225 , H01L2225/06517 , H01L2225/0652 , H01L2225/06541 , H01L2225/06572 , H01L2924/00011 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/10253 , H01L2924/15311 , H01L2924/15331 , H01L2924/3511 , Y10T29/49117 , Y10T29/49126 , Y10T29/49144 , Y10T29/49155 , Y10T29/49165 , H01L2924/00 , H01L2224/0401
摘要： An interposer to be interposed between a semiconductor chip to be mounted thereon and a packaging board has an interposer portion made of a semiconductor and an interposer portion provided around the foregoing interposer portion integrally therewith. On both surfaces of the interposer portions, wiring patterns are formed via insulating layers. The wiring patterns are electrically connected via through holes formed at required positions in the interposer portions. The outer interposer portion is made of an insulator or a metal body. Further, external connection terminals are bonded to one surface of the interposer.
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公开(公告)号：US5656855A
公开(公告)日：1997-08-12
申请号：US463961
申请日：1995-06-05
CPC分类号： H01L21/4821 , H01L23/49534 , H01L23/49541 , H01L23/49548 , H01L23/49582 , H01L2224/48091 , H01L2224/48247 , H01L24/48 , H01L2924/00014 , H01L2924/01078 , H01L2924/181 , H05K3/20 , H05K3/202 , H05K3/205 , H05K3/3421
摘要： In a method for manufacturing a lead frame, a predetermined pattern is formed on a matrix 10 by a resist, an electro-deposition portion is provided in a cavity formed in the resist patterns 12, and the electro-deposition pattern 13 is separated from the matrix 10. The resist pattern is formed on the matrix 10 so that a cavity portion 17 connecting a plurality of cavity 16 ends for inner lead formation can be included in the resist pattern, and an electro-deposition portion is provided into the cavity portion 17 so that the electro-deposition pattern 13 can be formed into a configuration in which the tip ends of the inner leads 22 are connected by a connecting piece 21, and the electro-deposition pattern 13 is separated from the matrix 10 while the tip ends of the inner leads 22 are connected by the connecting piece 21.
摘要翻译： 在引线框架的制造方法中，通过抗蚀剂在矩阵10上形成预定图案，在形成于抗蚀剂图案12的空腔中设置电沉积部，并将电沉积图案13从 抗蚀剂图案形成在矩阵10上，使得连接多个腔16的端部用于内引线形成的空腔部分17可以包括在抗蚀剂图案中，并且电沉积部分被设置到空腔部分17中 使得电沉积图案13可以形成为通过连接片21连接内引线22的末端的结构，并且电沉积图案13与基体10分离，同时末端 内引线22由连接片21连接。
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公开(公告)号：US09051907B2
公开(公告)日：2015-06-09
申请号：US13227501
申请日：2011-09-08
CPC分类号： F02M37/103 , F02B61/02 , F02M37/007 , F02M37/20 , F02M37/22
摘要： In an upright state where a vehicle is supported by a main stand, or and a tilted state where the vehicle is supported by a side stand, an inflow port of a fuel filter unit is located at a position higher than an outflow port. The fuel filter unit and the upstream side filter pipe are installed in the vehicle so that the upstream side filter pipe is arranged at a higher position as it goes toward the upstream side.
摘要翻译： 在车辆由主车架支撑的直立状态下，或者车辆由侧架支撑的倾斜状态下，燃料过滤器单元的流入口位于比流出口高的位置。 燃料过滤器单元和上游侧过滤管安装在车辆中，使得上游侧过滤管在向上游侧布置在更高的位置。
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公开(公告)号：US20140263968A1
公开(公告)日：2014-09-18
申请号：US14353113
申请日：2012-06-04
IPC分类号： H01L27/146
CPC分类号： H01L27/14625 , H01L27/14623 , H01L27/14645 , H04N9/045 , H04N9/097
摘要： An imaging apparatus 10 according to one implementation of the present invention includes: a plurality of photodetectors 5a and 5b; a transparent layer 2 provided at the side of a light-receiving surface 15a, 15b of the photodetectors 5a and 5b; a plurality of spectroscopic portions 3 provided between a light-entering surface 2a of the transparent layer 2 and the photodetectors 5a and 5b; and a plurality of high refractive index transparent members 6 provided closer to the photodetectors 5a and 5b than are the spectroscopic portions 3. The high refractive index transparent members 6 have a higher refractive index than does the transparent layer 2.
摘要翻译： 根据本发明的一个实施例的成像装置10包括：多个光电检测器5a和5b; 设置在光电检测器5a和5b的受光面15a，15b侧的透明层2; 设置在透明层2的光入射面2a与光检测器5a，5b之间的多个分光部3; 以及比分光部3更靠近光电探测器5a和5b设置的多个高折射率透明构件6.高折射率透明构件6具有比透明层2更高的折射率。
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公开(公告)号：US08591043B2
公开(公告)日：2013-11-26
申请号：US13165320
申请日：2011-06-21
IPC分类号： G03B21/14
CPC分类号： H04N9/3144 , G02F1/133308 , G02F1/133385 , G02F2001/13332 , G03B21/16 , G03B21/208
摘要： A light modulation device includes: a reflective light modulation element which modulates an incident light; a holding section which holds the reflective light modulation element; and a light blocking plate disposed on an incident side which incidents the incident light to the reflective light modulation element, and fixed to the holding section, wherein a thermal conductivity of the light blocking plate is equal to or higher than a thermal conductivity of the holding section.
摘要翻译： 光调制装置包括：对入射光进行调制的反射光调制元件; 保持部，其保持反射光调制元件; 以及遮光板，其设置在入射侧，将入射光入射到所述反射光调制元件，并且固定到所述保持部，其中所述遮光板的导热率等于或高于所述保持部的热导率 部分。
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