Invention Grant
- Patent Title: Integrated circiut arrangement
- Patent Title (中): 集成电路布置
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Application No.: US11264294Application Date: 2005-10-31
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Publication No.: US07388734B2Publication Date: 2008-06-17
- Inventor: Thomas Benetik , Uwe Hodel , Christoph Kienmayer , Martin Streibl , Marc Tiebout
- Applicant: Thomas Benetik , Uwe Hodel , Christoph Kienmayer , Martin Streibl , Marc Tiebout
- Applicant Address: DE
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE
- Agency: Dickstein, Shapiro, LLP.
- Priority: DE102004052868 20041102
- Main IPC: H02H9/00
- IPC: H02H9/00

Abstract:
Integrated circuit arrangement having first and second signal input pads, to which a differential input signal is applied, and first and second signal outputs, at which a differential output signal is provided. The first signal output is coupled to the first signal input pad and the second signal output is coupled to the second signal input pad. A first capacitance is between the first and second signal input pads. First and second inductances are connected in series, are between the first and second signal input pads, and are connected in parallel with the first capacitance. A first terminal is at a first supply potential and a second terminal is at a second supply potential. A first electrostatic discharge element is between the first and second terminals. A second electrostatic discharge element is between the first terminal, on the one hand, and the first and second inductances, on the other hand.
Public/Granted literature
- US20060103995A1 Integrated circuit arrangement Public/Granted day:2006-05-18
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