发明授权
- 专利标题: Bonding arm swinging type bonding apparatus
- 专利标题(中): 接合臂摆动式接合装置
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申请号: US11061272申请日: 2005-02-17
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公开(公告)号: US07389805B2公开(公告)日: 2008-06-24
- 发明人: Osamu Kakutani , Yutaka Kondo , Yoshihiko Seino
- 申请人: Osamu Kakutani , Yutaka Kondo , Yoshihiko Seino
- 申请人地址: JP Tokyo
- 专利权人: Kabushiki Kaisha Shinkawa
- 当前专利权人: Kabushiki Kaisha Shinkawa
- 当前专利权人地址: JP Tokyo
- 代理商 William L. Androlia; H. Henry Koda
- 优先权: JP2004-044576 20040220
- 主分类号: B32B37/00
- IPC分类号: B32B37/00 ; B32B39/00 ; B23K37/02
摘要:
A bonding arm swinging type bonding apparatus that has a rotational center 13 of the bonding arm 1 beneath the bonding arm. The rotating shaft parts 11 of circular arc form rotary motors 10 that rotate about the rotational center 13 of the bonding arm 1 are attached to the bonding arm 1, and the rotating shaft parts 21 of circular arc form air bearings 20 that rotate about this rotational center 13 are provided so that the rotating shaft parts of the circular arc form air bearings 20 are rotatable as a unit with the rotating shaft parts 11 of the rotary motors 10.
公开/授权文献
- US20050184127A1 Bonding arm swinging type bonding apparatus 公开/授权日:2005-08-25
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