公开(公告)号：US20050211746A1

公开(公告)日：2005-09-29

申请号：US11089262

申请日：2005-03-24

申请人： Osamu Kakutani ,  Yutaka Kondo ,  Yoshihiko Seino

发明人： Osamu Kakutani ,  Yutaka Kondo ,  Yoshihiko Seino

IPC分类号： H01L21/60 ,  B23K1/06 ,  B23K20/00

CPC分类号： B23K20/005 ,  H01L2224/78301 ,  H01L2224/7835 ,  H01L2224/78823

摘要： A bonding apparatus including a front link whose lower end is rotatably connected to a bonding arm and upper portion is rotatably connected to bonding head, and a rear link whose lower end is rotatably connected to the rear end of the bonding arm and upper portion is rotatably connected to the bonding head; and a hypothetical rotational center of capillary of the bonding arm is on a bonding surface and set to be the intersection of a line that connects upper and lower rotational centers of the front link and a line that connects upper and lower rotational centers of the rear link, wherein the immovable element of motor is fastened to the bonding head, and the rotational element of the motor is attached to the upper end of the rear link so that the rotational element rotates about the upper rotational center of the rear link.

摘要翻译： 一种接合装置，包括前连杆，其下端可旋转地连接到接合臂和上部，可转动地连接到接合头，并且后连杆的下端可旋转地连接到接合臂和上部的后端， 连接到焊接头; 并且接合臂的假想旋转中心位于接合面上，并且被设置为连接前连杆的上下旋转中心的线和连接后连杆的上下旋转中心的线 其特征在于，所述马达的不可移动元件固定在所述接合头上，所述马达的旋转元件安装在所述后连杆的上端，使得所述旋转元件围绕所述后连杆的上旋转中心旋转。

公开(公告)号：US07389805B2

公开(公告)日：2008-06-24

申请号：US11061272

申请日：2005-02-17

申请人： Osamu Kakutani ,  Yutaka Kondo ,  Yoshihiko Seino

发明人： Osamu Kakutani ,  Yutaka Kondo ,  Yoshihiko Seino

IPC分类号： B32B37/00 ,  B32B39/00 ,  B23K37/02

CPC分类号： B23K20/005 ,  H01L24/78 ,  H01L2224/78301 ,  H01L2224/7835 ,  H01L2224/78822 ,  H01L2224/78823 ,  H01L2924/00014 ,  Y10S228/904 ,  H01L2224/48 ,  H01L2224/45099

摘要： A bonding arm swinging type bonding apparatus that has a rotational center 13 of the bonding arm 1 beneath the bonding arm. The rotating shaft parts 11 of circular arc form rotary motors 10 that rotate about the rotational center 13 of the bonding arm 1 are attached to the bonding arm 1, and the rotating shaft parts 21 of circular arc form air bearings 20 that rotate about this rotational center 13 are provided so that the rotating shaft parts of the circular arc form air bearings 20 are rotatable as a unit with the rotating shaft parts 11 of the rotary motors 10.

摘要翻译： 一种接合臂摆动式接合装置，其在接合臂下方具有接合臂1的旋转中心13。 围绕接合臂1的旋转中心13旋转的圆弧形旋转马达10的旋转轴部11被安装到接合臂1，并且圆弧的旋转轴部21形成空气轴承20，该空气轴承20围绕该旋转 中心13设置成使得圆弧形的空气轴承20的旋转轴部分能够与旋转马达10的旋转轴部分11一起旋转。

公开(公告)号：US07306132B2

公开(公告)日：2007-12-11

申请号：US11089262

申请日：2005-03-24

申请人： Osamu Kakutani ,  Yutaka Kondo ,  Yoshihiko Seino

发明人： Osamu Kakutani ,  Yutaka Kondo ,  Yoshihiko Seino

IPC分类号： H01L21/60

CPC分类号： B23K20/005 ,  H01L2224/78301 ,  H01L2224/7835 ,  H01L2224/78823

摘要： A bonding apparatus including a front link whose lower end is rotatably connected to a bonding arm and upper portion is rotatably connected to bonding head, and a rear link whose lower end is rotatably connected to the rear end of the bonding arm and upper portion is rotatably connected to the bonding head; and a hypothetical rotational center of capillary of the bonding arm is on a bonding surface and set to be the intersection of a line that connects upper and lower rotational centers of the front link and a line that connects upper and lower rotational centers of the rear link, wherein the immovable element of motor is fastened to the bonding head, and the rotational element of the motor is attached to the upper end of the rear link so that the rotational element rotates about the upper rotational center of the rear link.

摘要翻译： 一种接合装置，包括前连杆，其下端可旋转地连接到接合臂和上部，可转动地连接到接合头，并且后连杆的下端可旋转地连接到接合臂和上部的后端， 连接到焊接头; 并且接合臂的假想旋转中心位于接合面上，并且被设置为连接前连杆的上下旋转中心的线和连接后连杆的上下旋转中心的线 其特征在于，所述马达的不可移动元件固定在所述接合头上，所述马达的旋转元件安装在所述后连杆的上端，使得所述旋转元件围绕所述后连杆的上旋转中心旋转。

公开(公告)号：US20050184127A1

公开(公告)日：2005-08-25

申请号：US11061272

申请日：2005-02-17

申请人： Osamu Kakutani ,  Yutaka Kondo ,  Yoshihiko Seino

发明人： Osamu Kakutani ,  Yutaka Kondo ,  Yoshihiko Seino

IPC分类号： H01L21/60 ,  B23K1/06 ,  B23K5/20 ,  B23K20/00 ,  H01L23/48

CPC分类号： B23K20/005 ,  H01L24/78 ,  H01L2224/78301 ,  H01L2224/7835 ,  H01L2224/78822 ,  H01L2224/78823 ,  H01L2924/00014 ,  Y10S228/904 ,  H01L2224/48 ,  H01L2224/45099

摘要： A bonding arm swinging type bonding apparatus that has a rotational center 13 of the bonding arm 1 beneath the bonding arm. The rotating shaft parts 11 of circular arc form rotary motors 10 that rotate about the rotational center 13 of the bonding arm 1 are attached to the bonding arm 1, and the rotating shaft parts 21 of circular arc form air bearings 20 that rotate about this rotational center 13 are provided so that the rotating shaft parts of the circular arc form air bearings 20 are rotatable as a unit with the rotating shaft parts 11 of the rotary motors 10.

摘要翻译： 一种接合臂摆动式接合装置，其在接合臂下方具有接合臂1的旋转中心13。 围绕接合臂1的旋转中心13旋转的圆弧形旋转马达10的旋转轴部11被安装到接合臂1，并且圆弧的旋转轴部21形成空气轴承20，该空气轴承20围绕该旋转 中心13设置成使得圆弧形的空气轴承20的旋转轴部分能够与旋转马达10的旋转轴部分11一起旋转。

公开(公告)号：US20120018490A1

公开(公告)日：2012-01-26

申请号：US13242223

申请日：2011-09-23

申请人： Osamu Kakutani ,  Yutaka Kondo ,  Kohei Seyama

发明人： Osamu Kakutani ,  Yutaka Kondo ,  Kohei Seyama

IPC分类号： B23K20/10

CPC分类号： H01L24/85 ,  H01L24/78 ,  H01L2224/78302 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/3011 ,  H01L2224/48 ,  H01L2224/45099

摘要： An ultrasonic horn used in, for instance, a wire bonding apparatus and formed with mounting flanges, including a slit and a cross-sectional shape varying portion; the slit being on the central axis in the horn's longitudinal direction and extending fore and aft relative to the center of the mounting flanges, the length of the slit(s) being equal to or greater than the width direction of a flange region that is between the opposing flanges, and at least a part of the cross-sectional shape varying portion being on the outer surface of the horn at a slit region in which the slit is formed. The stress center point in the cross-section of the ultrasonic horn at the flange region is positioned more to the inside than a straight line joining the stress center points in the cross-sections of the ultrasonic horn at the front and rear end portions of the slit.

公开(公告)号：US20100301101A1

公开(公告)日：2010-12-02

申请号：US12841386

申请日：2010-07-22

申请人： Kohei Seyama ,  Yutaka Kondo ,  Osamu Kakutani ,  Shigeru Hayata

发明人： Kohei Seyama ,  Yutaka Kondo ,  Osamu Kakutani ,  Shigeru Hayata

IPC分类号： B23K37/00 ,  B23K37/04

CPC分类号： H01L24/85 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/48247 ,  H01L2224/78301 ,  H01L2224/7835 ,  H01L2224/78823 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A bonding apparatus includes: a reference plane; a bonding arm configured to be rotated about a rotation center that is arranged separately from the reference plane and to move a capillary attached at a tip end thereof obliquely toward and away from the reference plane; and an imaging device for optically detecting bonding positions on a semiconductor chip and/or a lead frame, in which an angle between an optical axis being heading for the imaging device from the reference plane and the reference plane is approximately equal to an angle between a motion trajectory of a tip end of the capillary and the reference plane, and thereby the bonding apparatus can have a wide bonding area with a simple mechanism as well as perform high-speed and high-accuracy bonding.

摘要翻译： 接合装置包括：参考平面; 接合臂，其构造成围绕与参考平面分开布置的旋转中心旋转，并且使其尖端附近的毛细管倾斜地朝向和远离参考平面移动; 以及用于光学检测在半导体芯片和/或引线框架上的接合位置的成像装置，其中从参考平面前进到成像装置的光轴与参考平面之间的角度近似等于 毛细管的前端和参考平面的运动轨迹，因此接合装置可以具有与简单机构的宽的结合面积，以及执行高速和高精度的结合。

公开(公告)号：US20080304772A1

公开(公告)日：2008-12-11

申请号：US12156758

申请日：2008-06-04

申请人： Osamu Kakutani ,  Yutaka Kondo ,  Shoji Wada

发明人： Osamu Kakutani ,  Yutaka Kondo ,  Shoji Wada

IPC分类号： F16C32/06

CPC分类号： F16C29/025 ,  F16C29/12 ,  F16C32/0402 ,  F16C32/06 ,  F16C32/0603 ,  F16C32/0674

摘要： A hydrostatic guide system including a guide table, a transfer table, a floating amount sensor attached to the transfer table, and a control unit. The transfer table has an inner portion, in which a magnetic attraction unit including a yoke and an electromagnet is embedded, and an outer shell portion, which covers the side surface and the upper surface of the inner portion. After the inner portion houses the yoke and the electromagnet, a gap around the yoke and the electromagnet is filled with a material having appropriate strength, so that the inner portion is integrated with the outer shell portion, and the transfer surface is flattened as whole. A surrounding groove is provided around the transfer table, and pressurized fluid supplied into the groove is jetted out to the guide table.

摘要翻译： 一种静压导向系统，包括导向台，转印台，附接到转印台的浮动量传感器和控制单元。 转印台具有嵌入有包括磁轭和电磁体的磁性吸引单元的内部部分和覆盖内侧部分的侧表面和上表面的外壳部分。 在内部容纳磁轭和电磁体之后，通过具有适当强度的材料填充磁轭和电磁体周围的间隙，使得内部与外壳部分一体化，并且转印表面整体变平。 在转印台周围设置有周围的槽，并且供给到槽中的加压流体喷射到导向台。

公开(公告)号：US08511534B2

公开(公告)日：2013-08-20

申请号：US13242223

申请日：2011-09-23

申请人： Osamu Kakutani ,  Yutaka Kondo ,  Kohei Seyama

发明人： Osamu Kakutani ,  Yutaka Kondo ,  Kohei Seyama

IPC分类号： B23K20/00 ,  B23K20/10

CPC分类号： H01L24/85 ,  H01L24/78 ,  H01L2224/78302 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/3011 ,  H01L2224/48 ,  H01L2224/45099

摘要： An ultrasonic horn used in, for instance, a wire bonding apparatus and formed with mounting flanges, including a slit and a cross-sectional shape varying portion; the slit being on the central axis in the horn's longitudinal direction and extending fore and aft relative to the center of the mounting flanges, the length of the slit(s) being equal to or greater than the width direction of a flange region that is between the opposing flanges, and at least a part of the cross-sectional shape varying portion being on the outer surface of the horn at a slit region in which the slit is formed. The stress center point in the cross-section of the ultrasonic horn at the flange region is positioned more to the inside than a straight line joining the stress center points in the cross-sections of the ultrasonic horn at the front and rear end portions of the slit.

摘要翻译： 一种用于例如引线接合装置并且形成有包括狭缝和横截面形状变化部分的安装凸缘的超声波喇叭; 狭缝在喇叭长度方向的中心轴线上并相对于安装凸缘的中心在前后延伸，狭缝的长度等于或大于凸缘区域之间的宽度方向， 相对的凸缘，并且横截面形状变化部分的至少一部分在形成狭缝的狭缝区域处在喇叭的外表面上。 在超声波喇叭的法兰区域的横截面中的应力中心点位于比在超声波喇叭的前后端部的连接超声波喇叭的截面中的应力中心点的直线更靠内侧 狭缝

公开(公告)号：US08052026B2

公开(公告)日：2011-11-08

申请号：US11544231

申请日：2006-10-06

申请人： Osamu Kakutani ,  Yutaka Kondo ,  Kohei Seyama

发明人： Osamu Kakutani ,  Yutaka Kondo ,  Kohei Seyama

IPC分类号： B23K1/06

CPC分类号： H01L24/85 ,  H01L24/78 ,  H01L2224/78302 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/3011 ,  H01L2224/48 ,  H01L2224/45099

摘要： An ultrasonic horn used in, for instance, a wire bonding apparatus and formed with mounting flanges, including a slit and a cross-sectional shape varying portion; the slit being on the central axis in the horn's longitudinal direction and extending fore and aft relative to the center of the mounting flanges, the length of the slit(s) being equal to or greater than the width direction of a flange region that is between the opposing flanges, and at least a part of the cross-sectional shape varying portion being on the outer surface of the horn at a slit region in which the slit is formed. The stress center point in the cross-section of the ultrasonic horn at the flange region is positioned more to the inside than a straight line joining the stress center points in the cross-sections of the ultrasonic horn at the front and rear end portions of the slit.

摘要翻译： 一种用于例如引线接合装置并且形成有包括狭缝和横截面形状变化部分的安装凸缘的超声波喇叭; 狭缝在喇叭长度方向的中心轴线上并相对于安装凸缘的中心在前后延伸，狭缝的长度等于或大于凸缘区域之间的宽度方向， 相对的凸缘，并且横截面形状变化部分的至少一部分在形成狭缝的狭缝区域处在喇叭的外表面上。 在超声波喇叭的法兰区域的横截面中的应力中心点位于比在超声波喇叭的前后端部的连接超声波喇叭的截面中的应力中心点的直线更靠内侧 狭缝

公开(公告)号：US07886956B2

公开(公告)日：2011-02-15

申请号：US12841386

申请日：2010-07-22

申请人： Kohei Seyama ,  Yutaka Kondo ,  Osamu Kakutani ,  Shigeru Hayata

发明人： Kohei Seyama ,  Yutaka Kondo ,  Osamu Kakutani ,  Shigeru Hayata

IPC分类号： B23K31/02 ,  B23K37/00

CPC分类号： H01L24/85 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/48247 ,  H01L2224/78301 ,  H01L2224/7835 ,  H01L2224/78823 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A bonding apparatus includes: a reference plane; a bonding arm configured to be rotated about a rotation center that is arranged separately from the reference plane and to move a capillary attached at a tip end thereof obliquely toward and away from the reference plane; and an imaging device for optically detecting bonding positions on a semiconductor chip and/or a lead frame, in which an angle between an optical axis being heading for the imaging device from the reference plane and the reference plane is approximately equal to an angle between a motion trajectory of a tip end of the capillary and the reference plane, and thereby the bonding apparatus can have a wide bonding area with a simple mechanism as well as perform high-speed and high-accuracy bonding.

摘要翻译： 接合装置包括：参考平面; 接合臂，其构造成围绕与参考平面分开布置的旋转中心旋转，并且使其尖端附近的毛细管倾斜地朝向和远离参考平面移动; 以及用于光学检测在半导体芯片和/或引线框架上的接合位置的成像装置，其中从参考平面前进到成像装置的光轴与参考平面之间的角度近似等于 毛细管的前端和参考平面的运动轨迹，因此接合装置可以具有与简单机构的宽的结合面积，以及执行高速和高精度的结合。