Invention Grant
US07390683B2 Method of manufacturing a semiconductor device including a slab layer with a periodic air hole structure and a linear defect region
有权
制造半导体器件的方法,该半导体器件包括具有周期性空气孔结构的板层和线性缺陷区域
- Patent Title: Method of manufacturing a semiconductor device including a slab layer with a periodic air hole structure and a linear defect region
- Patent Title (中): 制造半导体器件的方法,该半导体器件包括具有周期性空气孔结构的板层和线性缺陷区域
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Application No.: US11375016Application Date: 2006-03-15
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Publication No.: US07390683B2Publication Date: 2008-06-24
- Inventor: Atsushi Sugitatsu , Hitoshi Tada , Susumu Noda
- Applicant: Atsushi Sugitatsu , Hitoshi Tada , Susumu Noda
- Applicant Address: JP Tokyo JP Kyoto
- Assignee: Mitsubishi Denki Kabushiki Kaisha,Kyoto University
- Current Assignee: Mitsubishi Denki Kabushiki Kaisha,Kyoto University
- Current Assignee Address: JP Tokyo JP Kyoto
- Agency: Leydig, Voit & Mayer, Ltd.
- Priority: JP2003-279587 20030725
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
A semiconductor device has a two-dimensional slab photonic crystal structure in which a substrate supports a sheet-like slab layer including, sequentially stacked, a lower cladding layer, an active layer, and an upper cladding layer. A periodic refractive index profile structure, in surfaces of the stacked layers, introduces a linear defect region that serves as a waveguide. A p-type region and an n-type region in the slab layer define a pn junction surface at a predetermined angle with respect to the surfaces of the stacked layers in the slab layer.
Public/Granted literature
- US20060157716A1 Method of manufacturing semiconductor device Public/Granted day:2006-07-20
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